| Copper wire bonding PS Chauhan, A Choubey, ZW Zhong, MG Pecht, PS Chauhan, ... Copper Wire Bonding, 1-9, 2014 | 141 | 2014 |
| Intermetallics characterization of lead-free solder joints under isothermal aging A Choubey, H Yu, M Osterman, M Pecht, F Yun, L Yonghong, X Ming Journal of Electronic Materials 37, 1130-1138, 2008 | 103 | 2008 |
| An Assessment of Immersion Silver Surface Finish for Lead-Free Electronics. W Wang, A Choubey, M Azarian, M Pecht Journal of electronic materials 38 (6), 2009 | 61 | 2009 |
| Microstructure and intermetallic formation in SnAgCu BGA components attached with SnPb solder under isothermal aging A Choubey, M Osterman, M Pecht IEEE Transactions on Device and Materials Reliability 8 (1), 160-167, 2008 | 34 | 2008 |
| Study of assembly processes for liquid crystal on silicon (LCoS) microdisplays A Choubey, F Andros, BG Sammakia IEEE Transactions on Components and Packaging Technologies 28 (2), 303-310, 2005 | 19 | 2005 |
| Pre-applied underfill RK Barr, E Anzures, JM Calvert, H Lei, D Fleming, AV Dhoble, A Choubey US Patent App. 14/312,682, 2015 | 13 | 2015 |
| Microstructural changes under isothermal aging and their influence on thermal fatigue reliability for tin-lead and lead-free solder joints, including microstructural changes … A Choubey University of Maryland, College Park, 2007 | 10 | 2007 |
| Lead-free assemblies for high temperature applications A Choubey, J Wu, S Ganesan, M Pecht Proceeding of IMAPS International Conference on High Temperature Electronics …, 2006 | 7 | 2006 |
| Photopatternable laminate BCB dielectric C O'Connor, R Barr, J Calvert, A Choubey, M Gallagher, E Iagodkine, ... International Symposium on Microelectronics 2014 (1), 000580-000584, 2014 | 6 | 2014 |
| FEA and analysis for BGA/CGA assemblies under thermal cycling A Choubey, R Ghaffarian Surface Mount International Proceedings, 2016 | 5 | 2016 |
| Non-Conductive Film (NCF) Underfill for Flip Chip Assembly and High Reliability A Choubey, E Anzures, D Fleming, A Dhoble, L Herong, R Barr, J Calvert, ... Dow Chemical: Midland, MI, USA, 2014 | 5 | 2014 |
| Durability of repaired and aged lead-free electronic assemblies A Choubey, M Osterman, M Pecht, D Hillman, R Collins IPC Printed Circuits Expo, APEX, and Designers Summit, 2007 | 3 | 2007 |
| Pre-applied underfill MK Gallagher, E Anzures, D Fleming, AV Dhoble, CQ Truong, A Choubey, ... US Patent App. 14/017,264, 2015 | 2 | 2015 |
| Bonding Metallurgies PS Chauhan, A Choubey, ZW Zhong, MG Pecht, PS Chauhan, ... Copper Wire Bonding, 39-56, 2014 | 1 | 2014 |
| Wire Bond Pads PS Chauhan, A Choubey, ZW Zhong, MG Pecht, PS Chauhan, ... Copper Wire Bonding, 111-131, 2014 | 1 | 2014 |
| Bonding Process PS Chauhan, A Choubey, ZW Zhong, MG Pecht, PS Chauhan, ... Copper Wire Bonding, 11-38, 2014 | 1 | 2014 |
| Pre-Applied Underfill (PAUF) for Fine Pitch Flip Chip 3D Chip Stacking A Choubey, E Anzures, A Dhoble, D Fleming, M Gallagher, I Lee, M Oliver, ... Additional Papers and Presentations 2012 (DPC), 001432-001451, 2012 | 1 | 2012 |
| Thermal Cycling Fatigue Life Qualification for Earth and MARS and Deep Space Mission J Forgrave, A Choubey Pasadena, CA: Jet Propulsion Laboratory, National Aeronautics and Space …, 2019 | | 2019 |
| Thermally-resilient image sensor packaging approach for Mars2020 Enhanced Engineering Cameras C McKinney, T Goodsall, R Ghaffarian, R Blank, M Blakely, A Choubey, ... 2019 IEEE Aerospace Conference, 1-10, 2019 | | 2019 |
| Non-Conductive Film (NCF) with No Voiding and High Reliability E Anzures, A Choubey, A Dhoble, D Fleming, R Barr, J Calvert, JS Oh IMAPSource Proceedings 2014 (DPC), 1-28, 2014 | | 2014 |
