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Effendi Leobandung
Effendi Leobandung
IBM Fellow
Verified email at us.ibm.com
Title
Cited by
Cited by
Year
A silicon single-electron transistor memory operating at room temperature
L Guo, E Leobandung, SY Chou
Science 275 (5300), 649-651, 1997
5961997
MOSFET with super-steep retrograded island
H Zhu, E Leobandung, AC Mocuta, DM Mocuta
US Patent 7,723,750, 2010
3442010
Observation of quantum effects and Coulomb blockade in silicon quantum‐dot transistors at temperatures over 100 K
E Leobandung, L Guo, Y Wang, SY Chou
Applied physics letters 67 (7), 938-940, 1995
3331995
A room-temperature silicon single-electron metal–oxide–semiconductor memory with nanoscale floating-gate and ultranarrow channel
L Guo, E Leobandung, SY Chou
Applied Physics Letters 70 (7), 850-852, 1997
2351997
Single-electron floating-gate MOS memory
SY Chou, L Guo, E Leobandung
US Patent 6,069,380, 2000
1852000
Single hole quantum dot transistors in silicon
E Leobandung, L Guo, SY Chou
Applied physics letters 67 (16), 2338-2340, 1995
1811995
Process of making densely patterned silicon-on-insulator (SOI) region on a wafer
E Leobandung, DK Sadana, DJ Schepis, GG Shahidi
US Patent 6,214,694, 2001
1552001
Double planar gated SOI MOSFET structure
JW Adkisson, JA Bracchitta, JJ Ellis-Monaghan, JB Lasky, E Leobandung, ...
US Patent 6,483,156, 2002
1442002
Integration of dual workfunction metal gate CMOS devices
BH Lee, E Leobandung, GG Shahidi
US Patent 6,653,698, 2003
1372003
Structure and method for manufacturing MOSFET with super-steep retrograded island
H Zhu, E Leobandung, AC Mocuta, DM Mocuta
US Patent 7,268,049, 2007
1352007
A 0.063 µm2 FinFET SRAM cell demonstration with conventional lithography using a novel integration scheme with aggressively scaled fin and gate pitch
VS Basker, T Standaert, H Kawasaki, CC Yeh, K Maitra, T Yamashita, ...
2010 Symposium on VLSI Technology, 19-20, 2010
1182010
Strained silicon NMOS devices with embedded source/drain
D Chidambarrao, E Leobandung, AC Mocuta, HS Yang, H Zhu
US Patent 6,881,635, 2005
1152005
Semiconductor device structure with active regions having different surface directions and methods
BB Doris, O Gluschenkov, M Ieong, E Leobandung, H Zhu
US Patent 7,354,806, 2008
1032008
RTA-driven intra-die variations in stage delay, and parametric sensitivities for 65nm technology
B Walsh, H Utomo, E Leobandung, A Mahorowala, D Mocuta, K Miyamoto, ...
2006 Symposium on VLSI Technology, 2006. Digest of Technical Papers., 170-171, 2006
962006
Partially-depleted SOI technology for digital logic
GG Shahidi, A Ajmera, F Assaderaghi, RJ Bolam, E Leobandung, ...
1999 IEEE International Solid-State Circuits Conference. Digest of Technical …, 1999
961999
Stacked nanowire device with variable number of nanowire channels
E Leobandung
US Patent 9,257,545, 2016
952016
Ultra-thin-body and BOX (UTBB) fully depleted (FD) device integration for 22nm node and beyond
Q Liu, A Yagishita, N Loubet, A Khakifirooz, P Kulkarni, T Yamamoto, ...
2010 Symposium on VLSI Technology, 61-62, 2010
912010
Ultra-thin, high quality strained silicon-on-insulator formed by elastic strain transfer
SW Bedell, AG Domenicucci, KE Fogel, E Leobandung, DK Sadana
US Patent 6,991,998, 2006
872006
Channel doping impact on FinFETs for 22nm and beyond
CH Lin, R Kambhampati, RJ Miller, TB Hook, A Bryant, W Haensch, ...
2012 Symposium on VLSI Technology (VLSIT), 15-16, 2012
852012
High performance 65 nm SOI technology with dual stress liner and low capacitance SRAM cell
E Leobandung, H Nayakama, D Mocuta, K Miyamoto, M Angyal, HV Meer, ...
Digest of Technical Papers. 2005 Symposium on VLSI Technology, 2005., 126-127, 2005
852005
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