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Co-authors
- B. CorbettTyndallVerified email at tyndall.ie
- Brendan RoycroftTyndall National Institute, UCCVerified email at tyndall.ie
- RP SchneiderGoogle or Raxium or Sandia or Infinera or Agilent or Hewlett Packard or HP or NorthwesternVerified email at google.com
- L. A. ColdrenProf. of ECE, University of California, Santa BarbaraVerified email at ece.ucsb.edu
- Padraic MorrisseyTechnology Manager, Photonic Packaging Group, Tyndall National Institute, Cork, IrelandVerified email at tyndall.ie
- Brian ThibeaultTechnical and Operational Director, UCSB Nanofabrication FacilityVerified email at ucsb.edu
- Mohamad DernaikaPhD Integrated Photonics group, Tyndall National InstituteVerified email at tyndall.ie
- Pelucchi EmanueleTyndall National Institute, University College CorkVerified email at tyndall.ie
- Agnieszka GocalińskaHead of Epitaxy, Trumpf Photonic ComponentsVerified email at trumpf.com
- Justin Kenneth AlexanderVerified email at umail.ucc.ie
- William CotterTyndall National InstituteVerified email at tyndall.ie
- Andrew EllisAston UniversityVerified email at aston.ac.uk
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