| La–silicate gate dielectrics fabricated by solid phase reaction between La metal and underlayers H Watanabe, N Ikarashi, F Ito Applied physics letters 83 (17), 3546-3548, 2003 | 66 | 2003 |
| Carbon-nanotube-based triode-field-emission displays using gated emitter structure F Ito, Y Tomihari, Y Okada, K Konuma, A Okamoto IEEE electron device letters 22 (9), 426-428, 2001 | 59 | 2001 |
| Improving reliability of copper dual-damascene interconnects by impurity doping and interface strengthening M Tada, M Abe, N Furutake, F Ito, T Tonegawa, M Sekine, Y Hayashi IEEE transactions on electron devices 54 (8), 1867-1877, 2007 | 34 | 2007 |
| Comprehensive chemistry designs in porous SiOCH film stacks and plasma etching gases for damageless Cu interconnects in advanced ULSI devices Y Hayashi, H Ohtake, J Kawahara, M Tada, S Saito, N Inoue, F Ito, ... IEEE transactions on semiconductor manufacturing 21 (3), 469-480, 2008 | 27 | 2008 |
| Second-harmonic generation from /Si(111) interfaces F Ito, H Hirayama Physical Review B 50 (15), 11208, 1994 | 26 | 1994 |
| Electron emission from single-walled carbon nanotubes with sharpened bundles F Ito, K Konuma, A Okamoto Journal of Applied Physics 89 (12), 8141-8145, 2001 | 22 | 2001 |
| Impact of barrier metal sputtering on physical and chemical damages in low-k SiOCH films with various hydrocarbon content N Inoue, N Furutake, F Ito, H Yamamoto, T Takeuchi, Y Hayashi Japanese journal of applied physics 47 (4S), 2468, 2008 | 21 | 2008 |
| Feasibility study of 45-nm-node scaled-down Cu interconnects with molecular-pore-stacking (MPS) SiOCH films M Tada, H Ohtake, F Ito, M Narihiro, T Taiji, Y Kasama, T Takeuchi, K Arai, ... IEEE transactions on electron devices 54 (4), 797-806, 2007 | 14 | 2007 |
| Robust porous SiOCH/Cu interconnects with ultrathin sidewall protection liners M Tada, T Tamura, F Ito, H Ohtake, M Narihiro, M Tagami, M Ueki, ... IEEE transactions on electron devices 53 (5), 1169-1179, 2006 | 14 | 2006 |
| Improvement of mechanical properties of porous SiOCH films by post-cure treatments F Ito, T Takeuchi, Y Hayashi Advanced Metallization Conference 2005(AMC 2005), 291-296, 2006 | 14 | 2006 |
| Effects of thermal annealing on emission characteristics and emitter surface properties of a Spindt-type field emission cathode F Ito, K Konuma, A Okamoto, A Yano Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1998 | 14 | 1998 |
| Robust Cu dual damascene interconnects with porous SiOCH films fabricated by low-damage multi-hard-mask etching technology H Ohtake, M Tagami, M Tada, M Ueki, M Abe, S Saito, F Ito, Y Hayashi IEEE transactions on semiconductor manufacturing 19 (4), 455-464, 2006 | 12 | 2006 |
| Moisture uptake impact on damage layer of porous low-k film in 80nm-pitched Cu interconnects M Tagami, A Ogino, H Miyajima, H Shobha, FH Baumann, F Ito, ... ECS Transactions 41 (7), 405, 2011 | 10 | 2011 |
| Robust low oxygen content Cu alloy for scaled-down ULSI interconnects based on metallurgical thermodynamic principles Y Hayashi, M Abe, M Tada, M Narihiro, M Tagami, M Ueki, N Inoue, F Ito, ... IEEE transactions on electron devices 56 (8), 1579-1587, 2009 | 8 | 2009 |
| Effect of hydrogen annealing on second‐harmonic generation from SiO2/Si(111) interfaces H Hirayama, F Ito, K Watanabe Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films 13 (3 …, 1995 | 8 | 1995 |
| Porous Low-k Impacts on Performance of Advanced LSI Devices with GHz Operations M Tada, N Inoue, J Kawahara, H Yamamoto, F Ito, T Fukai, M Ueki, ... Japanese Journal of Applied Physics 48 (4S), 04C031, 2009 | 7 | 2009 |
| Effects of thermal annealing on emission characteristics and surface properties of field emitter arrays F Ito, K Konuma, A Okamoto, A Yano, S Miyano Journal of applied physics 82 (12), 6267-6272, 1997 | 4 | 1997 |
| A Robust Low-/Cu Dual Damascene Interconnect (DDI) With Sidewall Protection Layer (SPL) M Ueki, M Tada, M Tagami, M Narihiro, F Ito, Y Hayashi IEEE transactions on device and materials reliability 11 (1), 98-105, 2011 | 3 | 2011 |
| Advanced Metallization for ULSI Applications J Koike, E Kondoh Japan Society of Applied Physics, 2013 | 2 | 2013 |
| Photo-stimulated desorption from porous low-k films by UV cure treatments with various wavelength F Ito, T Takeuchi, Y Hayashi Advanced Metallization Conference 2006(AMC 2006), 295-300, 2007 | 2 | 2007 |
