| Microstructure and mechanical properties of fiber laser welded QP980 steel W Guo, Z Wan, P Peng, Q Jia, G Zou, Y Peng Journal of Materials Processing Technology 256, 229-238, 2018 | 81 | 2018 |
| Microstructural evolution and deformation behavior of fiber laser welded QP980 steel joint W Li, L Ma, P Peng, Q Jia, Z Wan, Y Zhu, W Guo Materials Science and Engineering: A 717, 124-133, 2018 | 66 | 2018 |
| Microstructure and tensile behavior of fiber laser-welded blanks of DP600 and DP980 steels Q Jia, W Guo, W Li, Y Zhu, P Peng, G Zou Journal of Materials Processing Technology 236, 73-83, 2016 | 62 | 2016 |
| Microstructure and tensile-shear properties of resistance spot-welded medium Mn steel Q Jia, L Liu, W Guo, Y Peng, G Zou, Z Tian, YN Zhou Metals 8 (1), 48, 2018 | 53 | 2018 |
| Microstructure and mechanical properties of laser welded dissimilar joints between QP and boron alloyed martensitic steels Q Jia, W Guo, Z Wan, Y Peng, G Zou, Z Tian, YN Zhou Journal of Materials Processing Technology 259, 58-67, 2018 | 43 | 2018 |
| Laser weldability of TWIP980 with DP980/B1500HS/QP980 steels: Microstructure and mechanical properties W Guo, Z Wan, Q Jia, L Ma, H Zhang, C Tan, P Peng Optics & Laser Technology 124, 105961, 2020 | 40 | 2020 |
| Sintering mechanism of a supersaturated Ag–Cu nanoalloy film for power electronic packaging Q Jia, G Zou, W Wang, H Ren, H Zhang, Z Deng, B Feng, L Liu ACS applied materials & interfaces 12 (14), 16743-16752, 2020 | 40 | 2020 |
| Experimental and numerical study on local mechanical properties and failure analysis of laser welded DP980 steels Q Jia, W Guo, W Li, P Peng, Y Zhu, G Zou, Y Peng, Z Tian Materials Science and Engineering: A 680, 378-387, 2017 | 38 | 2017 |
| Microstructure-and strain rate-dependent tensile behavior of fiber laser-welded DP980 steel joint Q Jia, W Guo, P Peng, M Li, Y Zhu, G Zou Journal of Materials Engineering and Performance 25, 668-676, 2016 | 32 | 2016 |
| Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics W Wang, G Zou, Q Jia, H Zhang, B Feng, Z Deng, L Liu Materials Science and Engineering: A 793, 139894, 2020 | 30 | 2020 |
| High electrical and thermal conductivity of nano-Ag paste for power electronic applications HQ Zhang, HL Bai, Q Jia, W Guo, L Liu, GS Zou Acta Metallurgica Sinica (English Letters) 33, 1543-1555, 2020 | 26 | 2020 |
| Improved corrosion resistance of Ni-base Alloy 600 welded joint by laser shock peening Z Wan, W Dai, W Guo, Q Jia, H Zhang, J Xue, L Lin, P Peng Journal of Manufacturing Processes 80, 718-728, 2022 | 20 | 2022 |
| Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging Q Jia, G Zou, H Zhang, W Wang, H Ren, A Zhanwen, Z Deng, S Yan, ... Applied Surface Science 554, 149579, 2021 | 20 | 2021 |
| Effects of laser shock peening on microstructure and mechanical properties of TIG welded alloy 600 joints Z Wan, W Guo, Q Jia, G Chen, J Chi, H Zhang, S Wu, C Peng, P Peng Materials Science and Engineering: A 808, 140914, 2021 | 19 | 2021 |
| Mechanism of ultrasonic-assisted transient liquid phase bonding of 6061 Al alloy with cladded Zn-Al alloy in air Q Jia, Z Lai, H Zhang, H Bai, G Zou, C Pan, L Liu Journal of Materials Processing Technology 286, 116823, 2020 | 19 | 2020 |
| Long-lasting action mechanism of 3D skeleton regulated the residual stress fluctuations in SiCf/SiC heterogeneous joints Y Zhang, W Guo, Q Jia, B Zhang, Y Zhu, H Zhang Materials Characterization 200, 112922, 2023 | 16 | 2023 |
| Thermal stress reduction strategy for high-temperature power electronics with Ag sintering H Ren, G Zou, Q Jia, Z Deng, C Du, W Wang, L Liu Microelectronics Reliability 127, 114379, 2021 | 15 | 2021 |
| High-reliability wireless packaging for high-temperature SiC power device sintered by novel organic-free nanomaterial H Ren, G Zou, Z Zhao, M Wan, H Zhang, Q Jia, L Liu IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020 | 12 | 2020 |
| Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics H Zhang, H Bai, Q Jia, W Guo, G Zou, L Liu Microelectronics Reliability 111, 113727, 2020 | 12 | 2020 |
| Effect of Ag sintered bondline thickness on high-temperature reliability of SiC power devices Z Deng, G Zou, Q Jia, B Feng, H Zhang, H Ren, L Liu IEEE Transactions on Components, Packaging and Manufacturing Technology 11 …, 2021 | 11 | 2021 |
