Qiang Jia
Qiang Jia
在 mails.tsinghua.edu.cn 的电子邮件经过验证
标题
引用次数
引用次数
年份
Microstructure and mechanical properties of fiber laser welded QP980 steel
W Guo, Z Wan, P Peng, Q Jia, G Zou, Y Peng
Journal of Materials Processing Technology 256, 229-238, 2018
432018
Microstructure and tensile behavior of fiber laser-welded blanks of DP600 and DP980 steels
Q Jia, W Guo, W Li, Y Zhu, P Peng, G Zou
Journal of Materials Processing Technology 236, 73-83, 2016
362016
Microstructural evolution and deformation behavior of fiber laser welded QP980 steel joint
W Li, L Ma, P Peng, Q Jia, Z Wan, Y Zhu, W Guo
Materials Science and Engineering: A 717, 124-133, 2018
262018
Microstructure and tensile-shear properties of resistance spot-welded medium Mn steel
Q Jia, L Liu, W Guo, Y Peng, G Zou, Z Tian, YN Zhou
Metals 8 (1), 48, 2018
252018
Microstructure and mechanical properties of laser welded dissimilar joints between QP and boron alloyed martensitic steels
Q Jia, W Guo, Z Wan, Y Peng, G Zou, Z Tian, YN Zhou
Journal of Materials Processing Technology 259, 58-67, 2018
242018
Experimental and numerical study on local mechanical properties and failure analysis of laser welded DP980 steels
Q Jia, W Guo, W Li, P Peng, Y Zhu, G Zou, Y Peng, Z Tian
Materials Science and Engineering: A 680, 378-387, 2017
242017
Microstructure-and strain rate-dependent tensile behavior of fiber laser-welded DP980 steel joint
Q Jia, W Guo, P Peng, M Li, Y Zhu, G Zou
Journal of Materials Engineering and Performance 25 (2), 668-676, 2016
202016
Laser weldability of TWIP980 with DP980/B1500HS/QP980 steels: Microstructure and mechanical properties
W Guo, Z Wan, Q Jia, L Ma, H Zhang, C Tan, P Peng
Optics & Laser Technology 124, 105961, 2020
152020
Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging
Q Jia, G Zou, W Wang, H Ren, H Zhang, Z Deng, B Feng, L Liu
ACS applied materials & interfaces 12 (14), 16743-16752, 2020
92020
The superplastic deformation behavior and phase evolution of Ti-6Al-4V alloy at constant tensile velocity
W Guo, Q Jia, R Li, W Li
High Temperature Materials and Processes 36 (1), 55-62, 2017
72017
Transient liquid phase bonding of nickel-base single crystal alloy with a novel Ni-Cr-Co-Mo-W-Ta-Re-B amorphous interlayer
W Guo, H Wang, Q Jia, P Peng, Y Zhu
High Temperature Materials and Processes 36 (7), 677-682, 2017
62017
High Electrical and Thermal Conductivity of Nano-Ag Paste for Power Electronic Applications
HQ Zhang, HL Bai, Q Jia, W Guo, L Liu, GS Zou
Acta Metallurgica Sinica (English Letters) 33 (11), 1543-1555, 2020
42020
Mechanical properties and microstructure of low temperature sintered joints using organic-free silver nanostructured film for die attachment of SiC power electronics
W Wang, G Zou, Q Jia, H Zhang, B Feng, Z Deng, L Liu
Materials Science and Engineering: A 793, 139894, 2020
42020
Effects of laser shock peening on microstructure and mechanical properties of TIG welded alloy 600 joints
Z Wan, W Guo, Q Jia, G Chen, J Chi, H Zhang, S Wu, C Peng, P Peng
Materials Science and Engineering: A 808, 140914, 2021
32021
Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics
H Zhang, H Bai, Q Jia, W Guo, G Zou, L Liu
Microelectronics Reliability 111, 113727, 2020
32020
Sintering mechanism of Ag-Pd nanoalloy film for power electronic packaging
Q Jia, G Zou, H Zhang, W Wang, H Ren, A Zhanwen, Z Deng, S Yan, ...
Applied Surface Science 554, 149579, 2021
22021
High-Reliability Wireless Packaging for High-Temperature SiC Power Device Sintered by Novel Organic-Free Nanomaterial
H Ren, G Zou, Z Zhao, M Wan, H Zhang, Q Jia, L Liu
IEEE Transactions on Components, Packaging and Manufacturing Technology 10 …, 2020
22020
Hardness Evolution and High Temperature Mechanical Properties of Laser Welded DP980 Steel Joints
Z Wan, W Guo, Q Jia, L Xu, P Peng
High Temperature Materials and Processes 37 (6), 587-595, 2018
22018
Mechanism of ultrasonic-assisted transient liquid phase bonding of 6061 Al alloy with cladded Zn-Al alloy in air
Q Jia, Z Lai, H Zhang, H Bai, G Zou, C Pan, L Liu
Journal of Materials Processing Technology 286, 116823, 2020
12020
Thermal stress reduction strategy for high-temperature power electronics with Ag sintering
H Ren, G Zou, Q Jia, Z Deng, C Du, W Wang, L Liu
Microelectronics Reliability 127, 114379, 2021
2021
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