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Yan-qing LuProfessor of College of Engineering and Applied Sciences, Nanjing UniversityVerified email at nju.edu.cn- Peng ChenAssociate Professor, College of Engineering and Applied Sciences, Nanjing UniversityVerified email at nju.edu.cn
- Shi-Jun GeNational Laboratory of Solid State Microstructures, Nanjing UniversityVerified email at smai.nju.edu.cn
- Bing-Yan WeiAssociate Professor, MOE Key Laboratory of Space Applied Physics and Chemistry, School of ScienceVerified email at nwpu.edu.cn
- Fei Xu （徐飞）Professor, College of Engineering and Applied Sciences,Nanjing University（南京大学）Verified email at nju.edu.cn
- Biaobing JinResearch Institute of Superconductor ElectronicsVerified email at nju.edu.cn
- Yang MingSenior Researcher, National Laboratory of Solid State Microstructures, Nanjing UniversityVerified email at nju.edu.cn
- Jingbo WuNanjing UniversityVerified email at nju.edu.cn
- Abhishek SrivastavaHong Kong University of Science and TechnologyVerified email at ust.hk
- Jianlin ZhaoNorthwestern Polytechnical UniversityVerified email at nwpu.edu.cn
- Yong ZhangProfessor, College of Engineering and Applied Sciences, Nanjing UniversityVerified email at nju.edu.cn
- Zhi-Han ZhuHarbin University of Science and TechnologyVerified email at hrbust.edu.cn
- HS KwokHong Kong University of Science and TechnologyVerified email at ust.hk
- Xiaopeng HuNanjing UniversityVerified email at nju.edu.cn
- Yan ZhangDepartment of Physics, Capital Normal UniversityVerified email at mail.cnu.edu.cn
- Xinke WangCapital Normal UniversityVerified email at cnu.edu.cn
- Haiwei ChenAmazon.com, Inc.Verified email at knights.ucf.edu
- Alwin TamResearch associate of Electronics and Computer Engineering. Hong Kong University of Science and TechnologyVerified email at connect.ust.hk
- Shuangchun WenHunan UniversityVerified email at hnu.edu.cn
- Xiaoshun JiangNanjing UniversityVerified email at nju.edu.cn
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