| Fast novel thermal analysis simulation tool for integrated circuits (FANTASTIC) L Codecasa, V d'Alessandro, A Magnani, N Rinaldi, PJ Zampardi 20th International Workshop on Thermal Investigations of ICs and Systems, 1-6, 2014 | 101 | 2014 |
| Circuit-based electrothermal simulation of power devices by an ultrafast nonlinear MOR approach L Codecasa, V d’Alessandro, A Magnani, A Irace IEEE Transactions on Power Electronics 31 (8), 5906-5916, 2015 | 80 | 2015 |
| SPICE modeling and dynamic electrothermal simulation of SiC power MOSFETs V d'Alessandro, A Magnani, M Riccio, G Breglio, A Irace, A Castellazzi IEEE 26th International Symposium on Power Semiconductor Devices and ICs …, 2014 | 52 | 2014 |
| Matrix reduction tool for creating boundary condition independent dynamic compact thermal models L Codecasa, V d'Alessandro, A Magnani, N Rinaldi 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 50 | 2015 |
| On-Line Junction Temperature Monitoring of Switching Devices with Dynamic Compact Thermal Models Extracted with Model Order Reduction F Di Napoli, A Magnani, M Coppola, P Guerriero, V D’Alessandro, ... Energies 10 (2), 189, 2017 | 44 | 2017 |
| Compact dynamic modeling for fast simulation of nonlinear heat conduction in ultra-thin chip stacking technology L Codecasa, V d’Alessandro, A Magnani, N Rinaldi IEEE Transactions on Components, Packaging and Manufacturing Technology 4 …, 2014 | 39 | 2014 |
| Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations V d’Alessandro, A Magnani, M Riccio, Y Iwahashi, G Breglio, N Rinaldi, ... Microelectronics reliability 53 (9-11), 1713-1718, 2013 | 35 | 2013 |
| Delphi-like dynamical compact thermal models using model order reduction B Rogié, L Codecasa, E Monier-Vinard, V Bissuel, N Laraqi, O Daniel, ... 2017 23rd International Workshop on Thermal Investigations of ICs and …, 2017 | 34 | 2017 |
| Novel MOR approach for extracting dynamic compact thermal models with massive numbers of heat sources L Codecasa, A Magnani, V d'Alessandro, N Rinaldi, AG Metzger, ... 2016 32nd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM …, 2016 | 30 | 2016 |
| Analysis of the Influence of Layout and Technology Parameters on the Thermal Impedance of GaAs HBT/BiFET Using a Highly-Efficient Tool A Magnani, V d'Alessandro, L Codecasa, PJ Zampardi, B Moser, ... Compound Semiconductor Integrated Circuit Symposium (CSICs), 2014 IEEE, 1-4, 2014 | 30 | 2014 |
| Thermal feedback blocks for fast and reliable electrothermal circuit simulation of power circuits at module level A Magnani, F Di Napoli, M Riccio, P Guerriero, V d'Alessandro, G Breglio, ... 2016 28th International Symposium on Power Semiconductor Devices and ICs …, 2016 | 28 | 2016 |
| Advanced thermal simulation of SiGe: C HBTs including back-end-of-line V d'Alessandro, A Magnani, L Codecasa, N Rinaldi, K Aufinger Microelectronics Reliability 67, 38-45, 2016 | 27 | 2016 |
| Simulation comparison of InGaP/GaAs HBT thermal performance in wire-bonding and flip-chip technologies V d'Alessandro, AP Catalano, A Magnani, L Codecasa, N Rinaldi, ... Microelectronics Reliability 78, 233-242, 2017 | 26 | 2017 |
| Parametric compact thermal models by moment matching for variable geometry L Codecasa, V d'Alessandro, A Magnani, N Rinaldi 20th International Workshop on Thermal Investigations of ICs and Systems, 1-6, 2014 | 26 | 2014 |
| Structure-preserving approach to multi-port dynamic compact models of nonlinear heat conduction L Codecasa, A Magnani, N Rinaldi Microelectronics Journal 46 (12), 1129-1137, 2015 | 25 | 2015 |
| Structure preserving approach to parametric dynamic compact thermal models of nonlinear heat conduction L Codecasa, V d'Alessandro, A Magnani, N Rinaldi 2015 21st International Workshop on Thermal Investigations of ICs and …, 2015 | 24 | 2015 |
| Fast Nonlinear Dynamic Compact Thermal Modeling With Multiple Heat Sources in Ultra-Thin Chip Stacking Technology L Codecasa, V d’Alessandro, A Magnani, N Rinaldi IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (1 …, 2017 | 23 | 2017 |
| Integration of 650 V GaN Power ICs on 200 mm Engineered Substrates X Li, K Geens, D Wellekens, M Zhao, A Magnani, N Amirifar, B Bakeroot, ... IEEE Transactions on Semiconductor Manufacturing 33 (4), 534-538, 2020 | 22 | 2020 |
| Dynamic electrothermal macromodeling: an application to signal integrity analysis in highly integrated electronic systems V d'Alessandro, M de Magistris, A Magnani, N Rinaldi, S Russo IEEE Transactions on Components, Packaging and Manufacturing Technology 3 (7 …, 2013 | 21 | 2013 |
| 200 V GaN-on-SOI Smart Power Platform for Monolithic GaN Power ICs T Cosnier, O Syshchyk, B De Jaeger, K Geens, D Cingu, E Fabris, ... 2021 IEEE International Electron Devices Meeting (IEDM), 5.1. 1-5.1. 4, 2021 | 19 | 2021 |
Vincenzo d'AlessandroFull Professor of Electronics, DIETI, University Federico II, Naples, ItalyVerified email at unina.it
