| Effect of temperature on the aging rate of Li ion battery operating above room temperature F Leng, CM Tan, M Pecht Scientific reports 5 (1), 12967, 2015 | 534 | 2015 |
| Electromigration in ULSI interconnects CM Tan, A Roy Materials Science and Engineering: R: Reports 58 (1-2), 1-75, 2007 | 285 | 2007 |
| Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy S Liu, AK Ng, R Xu, J Wei, CM Tan, Y Yang, Y Chen Nanoscale 2 (12), 2744-2750, 2010 | 204 | 2010 |
| Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc ZH Gan, GQ Yu, BK Tay, CM Tan, ZW Zhao, YQ Fu Journal of physics d: applied physics 37 (1), 81, 2003 | 198 | 2003 |
| Electrowetting control of Cassie-to-Wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites Z Han, B Tay, C Tan, M Shakerzadeh, K Ostrikov ACS nano 3 (10), 3031-3036, 2009 | 142 | 2009 |
| Aligned carbon nanotubes for through-wafer interconnects T Xu, Z Wang, J Miao, X Chen, CM Tan Applied Physics Letters 91 (4), 2007 | 126 | 2007 |
| Size, temperature, and bond nature dependence of elasticity and its derivatives on extensibility, Debye temperature, and heat capacity of nanostructures MX Gu, CQ Sun, Z Chen, TCA Yeung, S Li, CM Tan, V Nosik Physical Review B 75 (12), 125403, 2007 | 120 | 2007 |
| A framework to practical predictive maintenance modeling for multi-state systems CM Tan, N Raghavan Reliability Engineering & System Safety 93 (8), 1138-1150, 2008 | 115 | 2008 |
| Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspectionscheduling MD Le, CM Tan Reliability Engineering & System Safety 113, 21-29, 2013 | 109 | 2013 |
| FTIR spectroscopy as a tool for nano-material characterization C Baudot, CM Tan, JC Kong Infrared Physics & Technology 53 (6), 434-438, 2010 | 105 | 2010 |
| Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes YD Han, SML Nai, HY Jing, LY Xu, CM Tan, J Wei Journal of Materials Science: Materials in Electronics 22, 315-322, 2011 | 93 | 2011 |
| Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei Intermetallics 31, 72-78, 2012 | 88 | 2012 |
| Degradation physics of high power LEDs in outdoor environment and the role of phosphor in the degradation process P Singh, CM Tan Scientific reports 6 (1), 24052, 2016 | 86 | 2016 |
| Simulated annealing CM Tan BoD–Books on Demand, 2008 | 83 | 2008 |
| A reliability-based design concept for lithium-ion battery pack in electric vehicles Z Liu, CM Tan, F Leng Reliability Engineering & System Safety 134, 169-177, 2015 | 81 | 2015 |
| Electromigration performance of Through Silicon Via (TSV)–A modeling approach YC Tan, CM Tan, XW Zhang, TC Chai, DQ Yu Microelectronics Reliability 50 (9-11), 1336-1340, 2010 | 81 | 2010 |
| Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei Journal of Electronic Materials 39, 223-229, 2010 | 80 | 2010 |
| Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects CM Tan, A Roy Thin Solid Films 504 (1-2), 288-293, 2006 | 73 | 2006 |
| Revisit to the finite element modeling of electromigration for narrow interconnects CM Tan, Y Hou, W Li Journal of Applied Physics 102 (3), 2007 | 72 | 2007 |
| Customer‐focused build‐in reliability: a case study C Ming Tan International Journal of Quality & Reliability Management 20 (3), 378-397, 2003 | 72 | 2003 |
Nagarajan RaghavanAssociate Professor, Singapore University of Technology & Design (SUTD)Verified email at sutd.edu.sg
