Cher Ming Tan
Cher Ming Tan
Professor of Electronics Department, Chang Gung University
Verified email at - Homepage
Cited by
Cited by
Effect of temperature on the aging rate of Li ion battery operating above room temperature
F Leng, CM Tan, M Pecht
Scientific reports 5 (1), 1-12, 2015
Electromigration in ULSI interconnects
CM Tan, A Roy
Materials Science and Engineering: R: Reports 58 (1-2), 1-75, 2007
Preparation and characterization of copper oxide thin films deposited by filtered cathodic vacuum arc
ZH Gan, GQ Yu, BK Tay, CM Tan, ZW Zhao, YQ Fu
Journal of physics d: applied physics 37 (1), 81, 2003
Antibacterial action of dispersed single-walled carbon nanotubes on Escherichia coli and Bacillus subtilis investigated by atomic force microscopy
S Liu, AK Ng, R Xu, J Wei, CM Tan, Y Yang, Y Chen
Nanoscale 2 (12), 2744-2750, 2010
Aligned carbon nanotubes for through-wafer interconnects
T Xu, Z Wang, J Miao, X Chen, CM Tan
Applied Physics Letters 91 (4), 042108, 2007
Electrowetting control of Cassie-to-Wenzel transitions in superhydrophobic carbon nanotube-based nanocomposites
Z Han, B Tay, C Tan, M Shakerzadeh, K Ostrikov
ACS nano 3 (10), 3031-3036, 2009
Size, temperature, and bond nature dependence of elasticity and its derivatives on extensibility, Debye temperature, and heat capacity of nanostructures
MX Gu, CQ Sun, Z Chen, TCA Yeung, S Li, CM Tan, V Nosik
Physical Review B 75 (12), 125403, 2007
A framework to practical predictive maintenance modeling for multi-state systems
CM Tan, N Raghavan
Reliability Engineering & System Safety 93 (8), 1138-1150, 2008
Optimal maintenance strategy of deteriorating system under imperfect maintenance and inspection using mixed inspectionscheduling
MD Le, CM Tan
Reliability Engineering & System Safety 113, 21-29, 2013
Electromigration performance of Through Silicon Via (TSV)–A modeling approach
YC Tan, CM Tan, XW Zhang, TC Chai, DQ Yu
Microelectronics Reliability 50 (9-11), 1336-1340, 2010
Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
YD Han, SML Nai, HY Jing, LY Xu, CM Tan, J Wei
Journal of Materials Science: Materials in Electronics 22 (3), 315-322, 2011
Interfacial reaction and shear strength of Ni-coated carbon nanotubes reinforced Sn–Ag–Cu solder joints during thermal cycling
YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei
Intermetallics 31, 72-78, 2012
Temperature dependence of creep and hardness of Sn-Ag-Cu lead-free solder
YD Han, HY Jing, SML Nai, LY Xu, CM Tan, J Wei
Journal of Electronic Materials 39 (2), 223-229, 2010
Investigation of the effect of temperature and stress gradients on accelerated EM test for Cu narrow interconnects
CM Tan, A Roy
Thin Solid Films 504 (1-2), 288-293, 2006
Revisit to the finite element modeling of electromigration for narrow interconnects
CM Tan, Y Hou, W Li
Journal of applied physics 102 (3), 033705, 2007
Simulated annealing
SC Wang
Interdisciplinary Computing in Java Programming, 59-79, 2003
Current crowding effect on copper dual damascene via bottom failure for ULSI applications
CM Tan, A Roy, AV Vairagar, A Krishnamoorthy, SG Mhaisalkar
IEEE Transactions on Device and Materials Reliability 5 (2), 198-205, 2005
Customer‐focused build‐in reliability: a case study
CM Tan
International Journal of Quality & Reliability Management, 2003
Time evolution degradation physics in high power white LEDs under high temperature-humidity conditions
CM Tan, P Singh
IEEE Transactions on Device and Materials Reliability 14 (2), 742-750, 2014
Analysis of humidity effects on the degradation of high-power white LEDs
CM Tan, BKE Chen, G Xu, Y Liu
Microelectronics Reliability 49 (9-11), 1226-1230, 2009
The system can't perform the operation now. Try again later.
Articles 1–20