| Comparative study on the isothermal aging of bare Cu and ENImAg surface finish for Sn-Ag-Cu solder joints MAR Adawiyah, OS Azlina Journal of Alloys and Compounds 740, 958-966, 2018 | 39 | 2018 |
| Microstructural and shear strength properties of GNSs-reinforced Sn-1.0 Ag-0.5 Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish K Vidyatharran, MAA Hanim, TT Dele-Afolabi, KA Matori, OS Azlina Journal of Materials Research and Technology 15, 2497-2506, 2021 | 26 | 2021 |
| The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces RA Mohamed Anuar, SA Osman Soldering & Surface Mount Technology 33 (2), 75-85, 2021 | 11 | 2021 |
| Interfacial microstructure evolution and shear strength of MWCNTs-reinforced Sn-1.0 Ag-0.5 Cu (SAC105) composite solder interconnects on plain Cu and ENIAg surface finish TT Dele-Afolabi, MAA Hanim, K Vidyatharran, KA Matori, OS Azlina, ... Journal of Materials Science: Materials in Electronics 33 (10), 8233-8246, 2022 | 10 | 2022 |
| A review of comparative study on the effect of hydroxyl gas in internal combustion engine (ICE) on engine performance and exhaust emission A Ridhuan, SA Osman, M Fawzi, AJ Alimin, SA Osman Journal of Advanced Research in Fluid Mechanics and Thermal Sciences 87 (2 …, 2021 | 9 | 2021 |
| Microstructural and shear strength properties of RHA-reinforced Sn–0.7 Cu composite solder joints on bare Cu and ENIAg surface finish MAA Hanim, NM Kamil, CK Wei, TT Dele-Afolabi, OS Azlina Journal of Materials Science: Materials in Electronics 31, 8316-8328, 2020 | 9 | 2020 |
| The effect of multiple reflow on intermetallic layer of Sn-4.0 AgCu/Cu by using microwave and reflow soldering JI Rasbudin, MAR Adawiyah, OS Azlina IOP Conference Series: Materials Science and Engineering 238 (1), 012014, 2017 | 9 | 2017 |
| Effect of reflow profile on intermetallic compound formation ISR Aisha, A Ourdjini, MAA Hanim, OS Azlina IOP Conference Series: Materials Science and Engineering 46 (1), 012037, 2013 | 9 | 2013 |
| Electroless and Immersion Plating Process towards Structures and IMC Formation MAR Adawiyah, OS Azlina, NA Fadil, SR Aisha, MA Hanim Int. J. Eng. Technol 8, 2558-2570, 2016 | 8 | 2016 |
| Effect of Solder Volume on Interfacial Reaction between SAC405 Solders and EN (B) EPIG Surface Finish S Azlina, A Ourdjini, A Amrin, I Siti Rabiatull Aisha Advanced Materials Research 845, 76-80, 2014 | 7 | 2014 |
| Effect of isothermal aging 2000 hours on intermetallics formed between Ni-Pd-Au with Sn-4Ag-0.5 Cu solders MAA Hanim, A Ourdjini, ISR Aisha, OS Azlina Advanced Materials Research 650, 194-199, 2013 | 6 | 2013 |
| Effect of nickel doping on interfacial reaction between lead-free solder and Ni-P substrate SA Osman, A Ourdjini, ISR Aisha Advanced Materials Research 488, 1375-1379, 2012 | 6 | 2012 |
| Tin Whiskers’ Behavior under Stress Load and the Mitigation Method for Immersion Tin Surface Finish NA Fadil, SZ Yusof, TA Abu Bakar, H Ghazali, MA Mat Yajid, SA Osman, ... Materials 14 (22), 6817, 2021 | 5 | 2021 |
| Effect of magnesium fluoride coating on corrosion behaviour of magnesium alloy OS Azlina, MS Ruba’ai, D Kurniawan IOP Conference Series: Materials Science and Engineering 694 (1), 012049, 2019 | 5 | 2019 |
| The effect of Bismuth on intermetallics growth between lead-free solders and electroless nickel immersion silver (ENIMAG) surface Finish J Zolhafizi, S Azlina Key Engineering Materials 796, 183-188, 2019 | 5 | 2019 |
| Interfacial reaction between SAC305 lead–free solders and ENImAg surface finish and bare copper: Grenzflächenreaktion zwischen bleifreien Lötmetallen SAC305 und ENImAg … MAR Adawiyah, OS Azlina Materialwissenschaft und Werkstofftechnik 48 (3-4), 235-240, 2017 | 5 | 2017 |
| Intermetallic compound formation on lead-free solders by using microwave energy S Mohamad Faizal, O Saliza Azlina AIP Conference Proceedings 1774 (1), 2016 | 5 | 2016 |
| The Effectiveness of Bismuth Addition to Retard the Intermetallic Compound Formation ISR Aisha, A Ourdjini, OS Azlina International Journal of Materials and Metallurgical Engineering 10 (1), 107-111, 2016 | 5 | 2016 |
| Comparison between SAC405 Lead-Free Solders and EN(P)EPIG and EN(B)EPIG Surface Finishes MHII O. Saliza Azlina, A. Ourdjini Applied Mechanics and Materials 773, 232-236, 2015 | 5 | 2015 |
| Intermetallic evolution for isothermal aging up to 2000 hours on sn-4ag-0.5 cu and sn-37pb solders with ni/au layers MAA Hanim, A Ourdjini, OS Azlina, ISR Aisha International Journal of Automotive and Mechanical Engineering 8, 1348-1356, 2013 | 5 | 2013 |
Dr. ALI OURDJINIUniversity of Ottawa在 uottawa.ca 的电子邮件经过验证
