| Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material JG Bai, ZZ Zhang, JN Calata, GQ Lu IEEE Transactions on components and packaging technologies 29 (3), 589-593, 2006 | 431 | 2006 |
| Low-temperature sintering with nano-silver paste in die-attached interconnection T Wang, X Chen, GQ Lu, GY Lei journal of electronic materials 36, 1333-1340, 2007 | 390 | 2007 |
| Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow Z Zhang, GQ Lu IEEE Transactions on electronics packaging manufacturing 25 (4), 279-283, 2002 | 271 | 2002 |
| Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips TG Lei, JN Calata, GQ Lu, X Chen, S Luo IEEE Transactions on Components and Packaging Technologies 33 (1), 98-104, 2009 | 267 | 2009 |
| Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly JG Bai, GQ Lu IEEE Transactions on device and materials reliability 6 (3), 436-441, 2006 | 252 | 2006 |
| The activation strain tensor: Nonhydrostatic stress effects on crystal-growth kinetics MJ Aziz, PC Sabin, GQ Lu Physical Review B 44 (18), 9812, 1991 | 208 | 1991 |
| Pressure‐enhanced crystallization kinetics of amorphous Si and Ge: Implications for point‐defect mechanisms GQ Lu, E Nygren, MJ Aziz Journal of applied physics 70 (10), 5323-5345, 1991 | 206 | 1991 |
| Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment D Yu, X Chen, G Chen, G Lu, Z Wang Materials & Design 30 (10), 4574-4579, 2009 | 196 | 2009 |
| High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment JG Bai, J Yin, Z Zhang, GQ Lu, JD van Wyk IEEE transactions on advanced packaging 30 (3), 506-510, 2007 | 187 | 2007 |
| Processing and characterization of nanosilver pastes for die-attaching SiC devices JG Bai, JN Calata, GQ Lu IEEE Transactions on electronics packaging manufacturing 30 (4), 241-245, 2007 | 167 | 2007 |
| Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕ or vortex magnetic field sensor S Dong, JG Bai, J Zhai, JF Li, GQ Lu, D Viehland, S Zhang, TR Shrout Applied Physics Letters 86 (18), 2005 | 144 | 2005 |
| Technology trends toward a system-in-a-module in power electronics FC Lee, JD van Wyk, D Boroyevich, GQ Lu, Z Liang, P Barbosa IEEE Circuits and systems magazine 2 (4), 4-22, 2002 | 135 | 2002 |
| Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance X Cao, T Wang, KDT Ngo, GQ Lu IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011 | 131 | 2011 |
| Survey of high-temperature polymeric encapsulants for power electronics packaging Y Yao, GQ Lu, D Boroyevich, KDT Ngo IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (2 …, 2015 | 130 | 2015 |
| A novel high-temperature planar package for SiC multichip phase-leg power module P Ning, TG Lei, F Wang, GQ Lu, KDT Ngo, K Rajashekara IEEE Transactions on power Electronics 25 (8), 2059-2067, 2010 | 129 | 2010 |
| Three-dimensional packaging for power semiconductor devices and modules JN Calata, JG Bai, X Liu, S Wen, GQ Lu IEEE transactions on advanced packaging 28 (3), 404-412, 2005 | 127 | 2005 |
| Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen Materials Letters 128, 42-45, 2014 | 126 | 2014 |
| An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures S Haque, K Xing, RL Lin, CTA Suchicital, GQ Lu, DJ Nelson, D Borojevic, ... IEEE Transactions on Advanced Packaging 22 (2), 136-144, 1999 | 118 | 1999 |
| A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging GQ Lu, JN Calata, Z Zhang, JG Bai Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem …, 2004 | 111 | 2004 |
| Effects of solder joint shape and height on thermal fatigue lifetime X Liu, GQ Lu IEEE Transactions on Components and Packaging Technologies 26 (2), 455-465, 2003 | 107 | 2003 |
Khai NgoProfessor of Electrical and Computer Engineering, Virginia TechVerified email at vt.edu
