GQ Lu or Guo-Quan Lu or G-Q Lu
Cited by
Cited by
Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material
JG Bai, ZZ Zhang, JN Calata, GQ Lu
IEEE Transactions on components and packaging technologies 29 (3), 589-593, 2006
Low-temperature sintering with nano-silver paste in die-attached interconnection
T Wang, X Chen, GQ Lu, GY Lei
journal of electronic materials 36, 1333-1340, 2007
Pressure-assisted low-temperature sintering of silver paste as an alternative die-attach solution to solder reflow
Z Zhang, GQ Lu
IEEE Transactions on electronics packaging manufacturing 25 (4), 279-283, 2002
Low-Temperature Sintering of Nanoscale Silver Paste for Attaching Large-Area Chips
TG Lei, JN Calata, GQ Lu, X Chen, S Luo
IEEE Transactions on Components and Packaging Technologies 33 (1), 98-104, 2009
Thermomechanical reliability of low-temperature sintered silver die attached SiC power device assembly
JG Bai, GQ Lu
IEEE Transactions on device and materials reliability 6 (3), 436-441, 2006
The activation strain tensor: Nonhydrostatic stress effects on crystal-growth kinetics
MJ Aziz, PC Sabin, GQ Lu
Physical Review B 44 (18), 9812, 1991
Pressure‐enhanced crystallization kinetics of amorphous Si and Ge: Implications for point‐defect mechanisms
GQ Lu, E Nygren, MJ Aziz
Journal of applied physics 70 (10), 5323-5345, 1991
High-temperature operation of SiC power devices by low-temperature sintered silver die-attachment
JG Bai, J Yin, Z Zhang, GQ Lu, JD van Wyk
IEEE transactions on advanced packaging 30 (3), 506-510, 2007
Applying Anand model to low-temperature sintered nanoscale silver paste chip attachment
D Yu, X Chen, G Chen, G Lu, Z Wang
Materials & Design 30 (10), 4574-4579, 2009
Processing and characterization of nanosilver pastes for die-attaching SiC devices
JG Bai, JN Calata, GQ Lu
IEEE Transactions on electronics packaging manufacturing 30 (4), 241-245, 2007
Technology trends toward a system-in-a-module in power electronics
FC Lee, JD van Wyk, D Boroyevich, GQ Lu, Z Liang, P Barbosa
IEEE Circuits and systems magazine 2 (4), 4-22, 2002
Characterization of lead-free solder and sintered nano-silver die-attach layers using thermal impedance
X Cao, T Wang, KDT Ngo, GQ Lu
IEEE Transactions on Components, Packaging and Manufacturing Technology 1 (4 …, 2011
A novel high-temperature planar package for SiC multichip phase-leg power module
P Ning, TG Lei, F Wang, GQ Lu, KDT Ngo, K Rajashekara
IEEE Transactions on power Electronics 25 (8), 2059-2067, 2010
Three-dimensional packaging for power semiconductor devices and modules
JN Calata, JG Bai, X Liu, S Wen, GQ Lu
IEEE transactions on advanced packaging 28 (3), 404-412, 2005
Circumferential-mode, quasi-ring-type, magnetoelectric laminate composite—a highly sensitive electric current and∕ or vortex magnetic field sensor
S Dong, JG Bai, J Zhai, JF Li, GQ Lu, D Viehland, S Zhang, TR Shrout
Applied Physics Letters 86 (18), 2005
Pressureless sintering of nanosilver paste at low temperature to join large area (≥ 100 mm2) power chips for electronic packaging
S Fu, Y Mei, GQ Lu, X Li, G Chen, X Chen
Materials Letters 128, 42-45, 2014
Survey of high-temperature polymeric encapsulants for power electronics packaging
Y Yao, GQ Lu, D Boroyevich, KDT Ngo
IEEE Transactions on Components, Packaging and Manufacturing Technology 5 (2 …, 2015
An innovative technique for packaging power electronic building blocks using metal posts interconnected parallel plate structures
S Haque, K Xing, RL Lin, CTA Suchicital, GQ Lu, DJ Nelson, D Borojevic, ...
IEEE Transactions on Advanced Packaging 22 (2), 136-144, 1999
A lead-free, low-temperature sintering die-attach technique for high-performance and high-temperature packaging
GQ Lu, JN Calata, Z Zhang, JG Bai
Proceedings of the Sixth IEEE CPMT Conference on High Density Microsystem …, 2004
Effects of solder joint shape and height on thermal fatigue lifetime
X Liu, GQ Lu
IEEE Transactions on Components and Packaging Technologies 26 (2), 455-465, 2003
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