| Designing and modeling for power integrity M Swaminathan, D Chung, S Grivet-Talocia, K Bharath, V Laddha, J Xie Electromagnetic Compatibility, IEEE Transactions on 52 (2), 288-310, 2010 | 160 | 2010 |
| Electrical-thermal co-simulation of 3D integrated systems with micro-fluidic cooling and Joule heating effects J Xie, M Swaminathan Components, Packaging and Manufacturing Technology, IEEE Transactions on 1 …, 2011 | 115 | 2011 |
| Coupling analysis of through-silicon via (TSV) arrays in silicon interposers for 3D systems B Xie, M Swaminathan, KJ Han, J Xie Electromagnetic Compatibility (EMC), 2011 IEEE International Symposium on, 16-21, 2011 | 43 | 2011 |
| Electrical–thermal cosimulation with nonconformal domain decomposition method for multiscale 3-D integrated systems J Xie, M Swaminathan Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014 | 37 | 2014 |
| Electrical-thermal co-analysis for power delivery networks in 3D system integration J Xie, D Chung, M Swaminathan, M Mcallister, A Deutsch, L Jiang, ... 3D System Integration, 2009. 3DIC 2009. IEEE International Conference on, 1-4, 2009 | 34 | 2009 |
| Vertical topologies of miniature multispiral stacked inductors WY Yin, JY Xie, K Kang, J Shi, JF Mao, XW Sun Microwave Theory and Techniques, IEEE Transactions on 56 (2), 475-486, 2008 | 31 | 2008 |
| A rigorous model for through-silicon vias with ohmic contact in silicon interposer DC Yang, J Xie, M Swaminathan, XC Wei, EP Li Microwave and Wireless Components Letters, IEEE 23 (8), 385-387, 2013 | 22 | 2013 |
| Electrical–thermal modeling of through‐silicon via (TSV) arrays in interposer J Xie, B Xie, M Swaminathan International Journal of Numerical Modelling: Electronic Networks, Devices …, 2013 | 19 | 2013 |
| Simulation of power delivery networks with Joule heating effects for 3D integration J Xie, M Swaminathan Electronic System-Integration Technology Conference (ESTC), 2010 3rd, 1-6, 2010 | 17 | 2010 |
| 3D transient thermal solver using non-conformal domain decomposition approach J Xie, M Swaminathan Proceedings of the International Conference on Computer-Aided Design, 333-340, 2012 | 15 | 2012 |
| DC IR drop solver for large scale 3D power delivery networks J Xie, M Swaminathan Electrical Performance of Electronic Packaging and Systems (EPEPS), 2010 …, 2010 | 15 | 2010 |
| System-Level Thermal Modeling Using Nonconformal Domain Decomposition and Model-Order Reduction J Xie, M Swaminathan Components, Packaging and Manufacturing Technology, IEEE Transactions on 4 …, 2014 | 14 | 2014 |
| Fast electrical-thermal co-simulation using multigrid method for 3D integration J Xie, M Swaminathan Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd, 651-657, 2012 | 13 | 2012 |
| Effect of system components on electrical and thermal characteristics for power delivery networks in 3D system integration J Xie, D Chung, M Swaminathan, M Mcallister, A Deutsch, L Jiang, ... Electrical Performance of Electronic Packaging and Systems, 2009. EPEPS'09 …, 2009 | 9 | 2009 |
| Electrical-thermal co-simulation with joule heating and convection effects for 3D systems J Xie, M Swaminathan US Patent 9,037,446, 2015 | 8 | 2015 |
| Optimization of 3D stack for electrical and thermal integrity R Bazaz, J Xie, M Swaminathan Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd, 22-28, 2013 | 7 | 2013 |
| Wideband Circuit Model of Silicon-Based Interconnects Up to 50 GHz G Luo, WY Yin, K Kang, JL Shi, JY Xie, JF Mao Microwave Conference, 2007. APMC 2007. Asia-Pacific, 1-4, 2007 | 3 | 2007 |
| Crosstalk reduction in TSV arrays with direct ohmic contact between metal and silicon-substrate DC Yang, EP Li, L Jun, XC Wei, JY Xie, M Swaminathan Electromagnetic Compatibility, Tokyo (EMC'14/Tokyo), 2014 International …, 2014 | 2 | 2014 |
| 3-D FDFD non-conformal domain decomposition method for modeling RDL traces on silicon interposer B Xie, M Swaminathan, KJ Han, J Xie Signal and Power Integrity (SPI), 2014 IEEE 18th Workshop on, 1-4, 2014 | 2 | 2014 |
| Computationally efficient thermal simulation with micro-fluidic cooling for 3D integration J Xie, M Swaminathan Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), 2011 …, 2011 | 2 | 2011 |
