| Failure mechanisms of solder interconnects under current stressing in advanced electronic packages YC Chan, D Yang Progress in Materials Science 55 (5), 428-475, 2010 | 291 | 2010 |
| Research advances in nano-composite solders J Shen, YC Chan Microelectronics Reliability 49 (3), 223-234, 2009 | 272 | 2009 |
| Growth kinetic studies of Cu–Sn intermetallic compound and its effect on shear strength of LCCC SMT solder joints YC Chan, ACK So, JKL Lai Materials Science and Engineering: B 55 (1-2), 5-13, 1998 | 225 | 1998 |
| Effect of intermetallic compounds on the thermal fatigue of surface mount solder joints PL Tu, YC Chan, JKL Lai IEEE Transactions on Components, Packaging, and Manufacturing Technology …, 1997 | 221 | 1997 |
| Effects of bonding parameters on the reliability performance of anisotropic conductive adhesive interconnects for flip-chip-on-flex packages assembly II. Different bonding pressure YC Chan, DY Luk Microelectronics Reliability 42 (8), 1195-1204, 2002 | 196 | 2002 |
| Investigations of interfacial reactions of Sn–Zn based and Sn–Ag–Cu lead-free solder alloys as replacement for Sn–Pb solder MN Islam, YC Chan, MJ Rizvi, W Jillek Journal of Alloys and compounds 400 (1-2), 136-144, 2005 | 175 | 2005 |
| Investigations on microhardness of Sn–Zn based lead-free solder alloys as replacement of Sn–Pb solder RA Islam, BY Wu, MO Alam, YC Chan, W Jillek Journal of alloys and compounds 392 (1-2), 149-158, 2005 | 170 | 2005 |
| Growth kinetics of intermetallic compounds in chip scale package solder joint PL Tu, YC Chan, KC Hung, JKL Lai Scripta materialia 44 (2), 317-323, 2001 | 165 | 2001 |
| Reliability study of the electroless Ni–P layer against solder alloy MO Alam, YC Chan, KC Hung Microelectronics Reliability 42 (7), 1065-1073, 2002 | 151 | 2002 |
| Interfacial intermetallic growth and mechanical properties of carbon nanotubes reinforced Sn3. 5Ag0. 5Cu solder joint under current stressing S Xu, YC Chan, K Zhang, KC Yung Journal of alloys and compounds 595, 92-102, 2014 | 144 | 2014 |
| Fast response resistive humidity sensitivity of polyimide/multiwall carbon nanotube composite films QY Tang, YC Chan, K Zhang Sensors and Actuators B: Chemical 152 (1), 99-106, 2011 | 141 | 2011 |
| Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn–Ag solder and Au/electroless Ni (P)/Cu bond pad MO Alam, YC Chan, KN Tu Journal of Applied Physics 94 (6), 4108-4115, 2003 | 140 | 2003 |
| Microstructures and properties of new Sn–Ag–Cu lead-free solder reinforced with Ni-coated graphene nanosheets G Chen, F Wu, C Liu, VV Silberschmidt, YC Chan Journal of Alloys and Compounds 656, 500-509, 2016 | 139 | 2016 |
| Growth mechanism of Ni3Sn4 in a Sn/Ni liquid/solid interfacial reaction J Shen, YC Chan, SY Liu Acta Materialia 57 (17), 5196-5206, 2009 | 132 | 2009 |
| Effect of volume in interfacial reaction between eutectic Sn-3.5% Ag-0.5% Cu solder and Cu metallization in microelectronic packaging MN Islam, A Sharif, YC Chan Journal of electronic materials 34, 143-149, 2005 | 129 | 2005 |
| Carrier transport in thin films of organic electroluminescent materials Z Deng, ST Lee, DP Webb, YC Chan, WA Gambling Synthetic metals 107 (2), 107-109, 1999 | 129 | 1999 |
| Effect of additions of ZrO2 nano-particles on the microstructure and shear strength of Sn–Ag–Cu solder on Au/Ni metallized Cu pads AK Gain, YC Chan, WKC Yung Microelectronics Reliability 51 (12), 2306-2313, 2011 | 128 | 2011 |
| Microstructure, thermal analysis and hardness of a Sn–Ag–Cu–1 wt% nano-TiO2 composite solder on flexible ball grid array substrates AK Gain, YC Chan, WKC Yung Microelectronics Reliability 51 (5), 975-984, 2011 | 127 | 2011 |
| Adhesion strength and contact resistance of flip chip on flex packages––effect of curing degree of anisotropic conductive film MA Uddin, MO Alam, YC Chan, HP Chan Microelectronics Reliability 44 (3), 505-514, 2004 | 126 | 2004 |
| Assessment of toxicity potential of metallic elements in discarded electronics: a case study of mobile phones in China BY Wu, YC Chan, A Middendorf, X Gu, HW Zhong Journal of Environmental Sciences 20 (11), 1403-1408, 2008 | 121 | 2008 |
