| Ageing and failure modes of IGBT modules in high-temperature power cycling V Smet, F Forest, JJ Huselstein, F Richardeau, Z Khatir, S Lefebvre, ... IEEE transactions on industrial electronics 58 (10), 4931-4941, 2011 | 690 | 2011 |
| A review of SiC power module packaging technologies: Challenges, advances, and emerging issues H Lee, V Smet, R Tummala IEEE Journal of Emerging and Selected Topics in Power Electronics 8 (1), 239-255, 2019 | 348 | 2019 |
| Evaluation ofMonitoring as a Real-Time Method to Estimate Aging of Bond Wire-IGBT Modules Stressed by Power Cycling V Smet, F Forest, JJ Huselstein, A Rashed, F Richardeau IEEE Transactions on Industrial Electronics 60 (7), 2760-2770, 2012 | 257 | 2012 |
| Review of thermal packaging technologies for automotive power electronics for traction purposes J Broughton, V Smet, RR Tummala, YK Joshi Journal of Electronic Packaging 140 (4), 040801, 2018 | 131 | 2018 |
| Design and comparison of inductors and intercell transformers for filtering of PWM inverter output FÇ Forest, E LabourÉ, TA Meynard, V Smet IEEE Transactions on Power Electronics 24 (3), 812-821, 2009 | 116 | 2009 |
| Ultrathin antenna-integrated glass-based millimeter-wave package with through-glass vias AO Watanabe, TH Lin, M Ali, Y Wang, V Smet, PM Raj, MM Tentzeris, ... IEEE Transactions on Microwave Theory and Techniques 68 (12), 5082-5092, 2020 | 59 | 2020 |
| A review of nanoporous metals in interconnects K Mohan, N Shahane, R Liu, V Smet, A Antoniou Jom 70, 2192-2204, 2018 | 49 | 2018 |
| First demonstration of panel glass fan-out (GFO) packages for high I/O density and high frequency multi-chip integration T Shi, C Buch, V Smet, Y Sato, L Parthier, F Wei, C Lee, V Sundaram, ... 2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 41-46, 2017 | 49 | 2017 |
| Design and demonstration of a 2.5-D glass interposer BGA package for high bandwidth and low cost BMD Sawyer, Y Suzuki, R Furuya, C Nair, TC Huang, V Smet, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (4 …, 2017 | 44 | 2017 |
| Board-level thermal cycling and drop-test reliability of large, ultrathin glass BGA packages for smart mobile applications B Singh, G Menezes, S McCann, V Jayaram, U Ray, V Sundaram, ... IEEE Transactions on Components, Packaging and Manufacturing Technology 7 (5 …, 2017 | 38 | 2017 |
| 2.5 D glass panel embedded (GPE) packages with better I/O density, performance, cost and reliability than current silicon interposers and high-density fan-out packages S Ravichandran, S Yamada, G Park, HW Chen, T Shi, C Buch, F Liu, ... 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), 625-630, 2018 | 35 | 2018 |
| Aging and failure modes of IGBT power modules undergoing power cycling in high temperature environments V Smet Montpellier 2, 2010 | 34 | 2010 |
| Low-temperature, organics-free sintering of nanoporous copper for reliable, high-temperature and high-power die-attach interconnections K Mohan, N Shahane, PM Raj, A Antoniou, V Smet, R Tummala 2017 IEEE applied power electronics conference and exposition (APEC), 3083-3090, 2017 | 28 | 2017 |
| Low cost, high performance, and high reliability 2.5 D silicon interposer V Sundaram, Q Chen, T Wang, H Lu, Y Suzuki, V Smet, M Kobayashi, ... 2013 IEEE 63rd Electronic Components and Technology Conference, 342-347, 2013 | 27 | 2013 |
| Design of intercell transformers for high-power multicell interleaved flyback converter F Forest, E Labouré, B Gélis, V Smet, TA Meynard, JJ Huselstein IEEE Transactions on Power Electronics 24 (3), 580-591, 2009 | 26 | 2009 |
| Heterogeneous integration for artificial intelligence: Challenges and opportunities S Mukhopadhyay, Y Long, B Mudassar, CS Nair, BH DeProspo, ... IBM Journal of Research and Development 63 (6), 4: 1-4: 1, 2019 | 25 | 2019 |
| New structure of microelectronic packages with edge protection by coating V Sundaram, V Smet, RR Tummala US Patent App. 14/919,696, 2016 | 24 | 2016 |
| Modeling, design, fabrication and characterization of first large 2.5 D glass interposer as a superior alternative to silicon and organic interposers at 50 micron bump pitch B Sawyer, H Lu, Y Suzuki, Y Takagi, M Kobayashi, V Smet, T Sakai, ... 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 742-747, 2014 | 22 | 2014 |
| Design and demonstration of Glass Panel Embedding for 3D System Packages for heterogeneous integration applications S Ravichandran, S Yamada, T Ogawa, T Shi, F Liu, V Smet, V Sundaram, ... Journal of Microelectronics and Electronic Packaging 16 (3), 124-135, 2019 | 19 | 2019 |
| Thermocompression bonding process design and optimization for warpage mitigation of ultra-thin low-CTE package assemblies V Jayaram, S McCann, TC Huang, S Kawamoto, R Pulugurtha, V Smet, ... 2016 IEEE 66th Electronic Components and Technology Conference (ECTC), 101-107, 2016 | 17 | 2016 |
