Chuan Seng Tan
Cited by
Cited by
Wafer level 3-D ICs process technology
CS Tan, RJ Gutmann, LR Reif
Springer Science & Business Media, 2009
Method of forming a multi-layer semiconductor structure incorporating a processing handle member
R Reif, KN Chen, CS Tan, A Fan
US Patent 7,307,003, 2007
Technology, performance, and computer-aided design of three-dimensional integrated circuits
S Das, A Fan, KN Chen, CS Tan, N Checka, R Reif
Proceedings of the 2004 international symposium on Physical design, 108-115, 2004
Morphology and bond strength of copper wafer bonding
KN Chen, CS Tan, A Fan, R Reif
Electrochemical and Solid-State Letters 7 (1), G14, 2003
Cu–Cu diffusion bonding enhancement at low temperature by surface passivation using self-assembled monolayer of alkane-thiol
CS Tan, DF Lim, SG Singh, SK Goulet, M Bergkvist
Applied Physics Letters 95 (19), 2009
Low-threshold optically pumped lasing in highly strained germanium nanowires
S Bao, D Kim, C Onwukaeme, S Gupta, K Saraswat, KH Lee, Y Kim, D Min, ...
Nature Communications 8 (1), 1845, 2017
Microstructure evolution and abnormal grain growth during copper wafer bonding
KN Chen, A Fan, CS Tan, R Reif, CY Wen
Applied Physics Letters 81 (20), 3774-3776, 2002
Integration of III–V materials and Si-CMOS through double layer transfer process
KH Lee, S Bao, E Fitzgerald, CS Tan
Japanese Journal of Applied Physics 54 (3), 030209, 2015
Germanium-on-silicon nitride waveguides for mid-infrared integrated photonics
W Li, P Anantha, S Bao, KH Lee, X Guo, T Hu, L Zhang, H Wang, R Soref, ...
Applied physics letters 109 (24), 2016
Copper bonded layers analysis and effects of copper surface conditions on bonding quality for three-dimensional integration
KN Chen, CS Tan, A Fan, R Reif
Journal of Electronic Materials 34, 1464-1467, 2005
Bonding parameters of blanket copper wafer bonding
KN Chen, A Fan, CS Tan, R Reif
Journal of electronic materials 35, 230-234, 2006
Silicon multilayer stacking based on copper wafer bonding
CS Tan, R Reif
Electrochemical and solid-state Letters 8 (6), G147, 2005
High-efficiency GeSn/Ge multiple-quantum-well photodetectors with photon-trapping microstructures operating at 2 Ám
H Zhou, S Xu, Y Lin, YC Huang, B Son, Q Chen, X Guo, KH Lee, SCK Goh, ...
Optics express 28 (7), 10280-10293, 2020
Contact resistance measurement of bonded copper interconnects for three-dimensional integration technology
KN Chen, A Fan, CS Tan, R Reif
IEEE Electron Device Letters 25 (1), 10-12, 2004
Low-temperature thermal oxide to plasma-enhanced chemical vapor deposition oxide wafer bonding for thin-film transfer application
CS Tan, A Fan, KN Chen, R Reif
Applied Physics Letters 82 (16), 2649-2651, 2003
Low temperature CuCu thermo-compression bonding with temporary passivation of self-assembled monolayer and its bond strength enhancement
CS Tan, DF Lim, XF Ang, J Wei, KC Leong
Microelectronics Reliability 52 (2), 321-324, 2012
High-efficiency normal-incidence vertical pin photodetectors on a germanium-on-insulator platform
Y Lin, KH Lee, S Bao, X Guo, H Wang, J Michel, CS Tan
Photonics Research 5 (6), 702-709, 2017
Online condition monitoring system for DC-link capacitor in industrial power converters
P Sundararajan, MHM Sathik, F Sasongko, CS Tan, M Tariq, ...
IEEE Transactions on Industry Applications 54 (5), 4775-4785, 2018
Growth and characterization of germanium epitaxial film on silicon (001) using reduced pressure chemical vapor deposition
YH Tan, CS Tan
Thin Solid Films 520 (7), 2711-2716, 2012
Condition monitoring of DC-link capacitors using Goertzel algorithm for failure precursor parameter and temperature estimation
P Sundararajan, MHM Sathik, F Sasongko, CS Tan, J Pou, F Blaabjerg, ...
IEEE Transactions on Power Electronics 35 (6), 6386-6396, 2019
The system can't perform the operation now. Try again later.
Articles 1–20