| Surface treatments of plant fibers and their effects on mechanical properties of fiber-reinforced composites: A review R Latif, S Wakeel, N Zaman Khan, A Noor Siddiquee, S Lal Verma, ... Journal of Reinforced Plastics and Composites 38 (1), 15-30, 2019 | 287 | 2019 |
| Enhancing mechanical response of monolithic magnesium using nano-NiTi (Nitinol) particles G Parande, V Manakari, S Wakeel, MS Kujur, M Gupta Metals 8 (12), 1014, 2018 | 44 | 2018 |
| Constituents and performance of no-clean flux for electronic solder S Wakeel, A Haseeb, MA Afifi, S Bingol, KL Hoon Microelectronics Reliability 123, 114177, 2021 | 34 | 2021 |
| Selection of sustainable material for the manufacturing of complex automotive products using a new hybrid Goal Programming Model for Best Worst Method–Proximity Indexed Value … S Wakeel, S Bingol, MN Bashir, S Ahmad Proceedings of the Institution of Mechanical Engineers, Part L: Journal of …, 2021 | 29 | 2021 |
| Synthesis and mechanical response of NiTi SMA nanoparticle reinforced Mg composites synthesized through microwave sintering process S Wakeel, V Manakari, G Parande, MS Kujur, M Gupta Materials Today: Proceedings 5 (14), 28203-28210, 2018 | 19 | 2018 |
| Effect of Ni and Co nanoparticle-doped flux on microstructure of SAC305 solder matrix MN Bashir, A Haseeb, S Wakeel, MA Khan, MM Quazi, NB Khan, ... Journal of Materials Science: Materials in Electronics 33 (25), 20106-20120, 2022 | 16 | 2022 |
| Selection of Automotive Brake Material Using Different MCDM Techniques and Their Comparisons. F Jahan, M Soni, S Wakeel, S Ahmad, S Bingol Journal of Engineering Science & Technology Review 15 (1), 2022 | 16 | 2022 |
| A new hybrid LGPMBWM-PIV method for automotive material selection S Wakeel, S Bingol, S Ahmad, MN Bashir, MSMM Emamat, Z Ding, ... Informatica 45 (1), 2021 | 14 | 2021 |
| A review on the mechanical properties of aluminium based metal matrix composite via powder metallurgy SW Ateeb Ahmad Khan International Journal of Innovation Science and Research 11 (November2017 …, 2017 | 12* | 2017 |
| A hybrid multi-criteria decision making method for robot selection in flexible manufacturing system S Ahmad, S Bingöl, S Wakeel Middle East Journal of Science 6 (2), 68-77, 2020 | 11 | 2020 |
| Supplier selection for high temperature die attach by hybrid entropy-range of value MCDM technique: a semiconductor industry S Wakeel, S Ahmad, S Bingol, MN Bashir, TC Paçal, ZA Khan 2020 21st International Conference on Electronic Packaging Technology (ICEPT …, 2020 | 7 | 2020 |
| Micro-transfer printing of thick optical components using a tether-free UV-curable approach S Wakeel, PE Morrisey, M Genc, P Ramaswamy, R Bernson, ... Journal of Optical Microsystems 4 (1), 011003-011003, 2024 | 6 | 2024 |
| A novel approach based on grey simplified best–worst method and grey possibility degree for evaluating materials in semiconductor industries MSMM Emamat, S Wakeel, M Amiri, S Ahmad, S Bingol Soft Computing 27 (22), 17043-17062, 2023 | 6 | 2023 |
| Investigation into chemistry and performance of no-clean flux in fine pitch flip-chip package S Wakeel, A Haseeb, MA Amalina, KL Hoon IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2021 | 6 | 2021 |
| Fabrication and Mechanical Properties of Aluminium Composites S Wakeel Scholar-press, omniscriptum publication group-Germany, 2017 | 5 | 2017 |
| Effects of commercial no-clean flux on reliability of fine pitch flip-chip package with solder bumps and copper pillars S Wakeel, A Haseeb, KL Hoon, MA Amalina IEEE Transactions on Components, Packaging and Manufacturing Technology 12 …, 2022 | 4 | 2022 |
| Effect of Zn nanoparticle-doped flux on mechanical properties of SAC305 solder joint after electromigration MN Bashir, NB Khan, S Bashir, AF Khan, MM Quazi, M Gul, S Wakeel, ... Journal of Materials Science: Materials in Electronics 34 (4), 321, 2023 | 3 | 2023 |
| Effect of plasma and staging time on the underfill voids in fine pitch flip-chip package S Wakeel, DKP Meng, SWW Chin, J Philipsen, P Gommers, A Joosten 2021 22nd International Conference on Electronic Packaging Technology (ICEPT …, 2021 | 2 | 2021 |
| Etching-free fabrication and integration of 45° micro-mirror for surface-compatible photonic packaging S Wakeel, M Hall, PE Morrissey, JS Lee, HY Hwang, K Gradkowski, ... Journal of Lightwave Technology 42 (24), 8778-8786, 2024 | 1 | 2024 |
| Packaging strategies for 3D integration of Photonic and Electronic chips on a Glass substrate R Bernson, S Wakeel, P Gupta, L Ranno, D Weninger, A Agarwal, ... 2023 IEEE 25th Electronics Packaging Technology Conference (EPTC), 804-808, 2023 | 1 | 2023 |
