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Aashish Shah, Ph.D.
Aashish Shah, Ph.D.
Principal Engineer, Team Lead for Process and Ultrasonics R&D, Kulicke and Soffa Industries Inc.
在 kns.com 的电子邮件经过验证 - 首页
标题
引用次数
引用次数
年份
In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding
A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon
Microelectronic Engineering 85 (9), 1851-1857, 2008
632008
Low-stress thermosonic copper ball bonding
A Shah, M Mayer, YN Zhou, SJ Hong, JT Moon
IEEE Transactions on Electronics Packaging Manufacturing 32 (3), 176-184, 2009
572009
Ultrasonic friction power during Al wire wedge-wedge bonding
A Shah, H Gaul, M Schneider-Ramelow, H Reichl, M Mayer, Y Zhou
Journal of applied physics 106 (1), 2009
432009
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
A Shah, A Rezvani, M Mayer, Y Zhou, J Persic, JT Moon
Microelectronics Reliability 51 (1), 67-74, 2011
392011
Advances in wire bonding technology for 3D die stacking and fan out wafer level package
I Qin, O Yauw, G Schulze, A Shah, B Chylak, N Wong
2017 IEEE 67th electronic components and technology conference (ECTC), 1309-1315, 2017
372017
Role of process parameters on bondability and pad damage indicators in copper ball bonding
I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou
Microelectronics Reliability 51 (1), 60-66, 2011
342011
The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor
H Gaul, A Shah, M Mayer, Y Zhou, M Schneider-Ramelow, H Reichl
Microelectronic Engineering 87 (4), 537-542, 2010
232010
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding
A Rezvani, A Shah, M Mayer, Y Zhou, JT Moon
Microelectronics Reliability 53 (7), 1002-1008, 2013
202013
Ultrasonic friction power during thermosonic Au and Cu ball bonding
A Shah, M Mayer, I Qin, C Huynh, Y Zhou, M Meyer
Journal of Physics D: Applied Physics 43 (32), 325301, 2010
192010
Reduction of underpad stress in thermosonic copper ball bonding
A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon
2008 58th Electronic Components and Technology Conference, 2123-2130, 2008
192008
Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor
A Shah, J Lee, M Mayer, YN Zhou
Sensors and Actuators A: Physical 148 (2), 462-471, 2008
182008
Free-air ball formation and deformability with Pd coated Cu wire
A Rezvani, M Mayer, A Shah, N Zhou, SJ Hong, JT Moon
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1516-1522, 2011
172011
Availability analysis of a generalized maintainable threestate device parallel system with human error and commoncause failures
BS Dhillon, AS Shah
Journal of quality in maintenance Engineering 13 (4), 411-432, 2007
172007
Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding
A Shah, M Mayer, Y Zhou, J Persic, JT Moon
2009 11th Electronics Packaging Technology Conference, 10-15, 2009
162009
Effect of process parameters on pad damage during Au and Cu ball bonding processes
I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou
2009 11th Electronics Packaging Technology Conference, 573-578, 2009
132009
Reliability and availability analysis of three-state device redundant systems with human errors and common-cause failures
ASBS DHILLON
International Journal of Performability Engineering 3 (4), 411, 2007
122007
Advanced wire bonding technology for Ag wire
A Shah, T Rockey, H Xu, I Qin, W Jie, O Yauw, B Chylak
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-8, 2015
112015
Advances in wire bonding technology for different bonding wire material
I Qin, A Shah, H Xu, B Chylak, N Wong
International Symposium on Microelectronics 2015 (1), 000406-000412, 2015
112015
Thermosonic Au ball bonding process investigated using microsensor and laser vibrometer
I Qin, A Shah, C Huynh, D DeAngelis, M Meyer, M Mayer, Y Zhou
2010 Proceedings 60th Electronic Components and Technology Conference (ECTC …, 2010
92010
Ball Bond Process Optimization with Cu and Pd Coated Cu Wire
I Qin, B Chylak, H Clauberg, A Shah, J Foley
Proceedings of Semicon China Conference 2012, 2012
82012
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