Aashish Shah, Ph.D.
Aashish Shah, Ph.D.
Principal Engineer, Team Lead for Process and Ultrasonics R&D, Kulicke and Soffa Industries Inc.
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标题
引用次数
引用次数
年份
In situ ultrasonic force signals during low-temperature thermosonic copper wire bonding
A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon
Microelectronic Engineering 85 (9), 1851-1857, 2008
582008
Low-stress thermosonic copper ball bonding
A Shah, M Mayer, YN Zhou, SJ Hong, JT Moon
IEEE Transactions on Electronics Packaging Manufacturing 32 (3), 176-184, 2009
522009
Ultrasonic friction power during Al wire wedge-wedge bonding
A Shah, H Gaul, M Schneider-Ramelow, H Reichl, M Mayer, Y Zhou
Journal of Applied Physics 106 (1), 013503, 2009
412009
Reduction of ultrasonic pad stress and aluminum splash in copper ball bonding
A Shah, A Rezvani, M Mayer, Y Zhou, J Persic, JT Moon
Microelectronics Reliability 51 (1), 67-74, 2011
372011
Role of process parameters on bondability and pad damage indicators in copper ball bonding
I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou
Microelectronics Reliability 51 (1), 60-66, 2011
292011
Advances in wire bonding technology for 3D die stacking and fan out wafer level package
I Qin, O Yauw, G Schulze, A Shah, B Chylak, N Wong
2017 IEEE 67th Electronic Components and Technology Conference (ECTC), 1309-1315, 2017
222017
The ultrasonic wedge/wedge bonding process investigated using in situ real-time amplitudes from laser vibrometer and integrated force sensor
H Gaul, A Shah, M Mayer, Y Zhou, M Schneider-Ramelow, H Reichl
Microelectronic Engineering 87 (4), 537-542, 2010
212010
Reduction of underpad stress in thermosonic copper ball bonding
A Shah, M Mayer, Y Zhou, SJ Hong, JT Moon
2008 58th Electronic Components and Technology Conference, 2123-2130, 2008
192008
Online methods to measure breaking force of bonding wire using a CMOS stress sensor and a proximity sensor
A Shah, J Lee, M Mayer, YN Zhou
Sensors and Actuators A: Physical 148 (2), 462-471, 2008
182008
Role of impact ultrasound on bond strength and Al pad splash in Cu wire bonding
A Rezvani, A Shah, M Mayer, Y Zhou, JT Moon
Microelectronics Reliability 53 (7), 1002-1008, 2013
172013
Optimization of ultrasound and bond force to reduce pad stress in thermosonic Cu ball bonding
A Shah, M Mayer, Y Zhou, J Persic, JT Moon
2009 11th Electronics Packaging Technology Conference, 10-15, 2009
162009
Method for identifying modulators of NAv ion channels
A Dubin, S Chaplan, S Brown, E Kaftan
US Patent 7,195,879, 2007
162007
Free-air ball formation and deformability with Pd coated Cu wire
A Rezvani, M Mayer, A Shah, N Zhou, SJ Hong, JT Moon
2011 IEEE 61st Electronic Components and Technology Conference (ECTC), 1516-1522, 2011
152011
Ultrasonic friction power during thermosonic Au and Cu ball bonding
A Shah, M Mayer, I Qin, C Huynh, Y Zhou, M Meyer
Journal of Physics D: Applied Physics 43 (32), 325301, 2010
152010
Availability analysis of a generalized maintainable threestate device parallel system with human error and commoncause failures
BS Dhillon, AS Shah
Journal of quality in maintenance Engineering, 2007
142007
Effect of process parameters on pad damage during Au and Cu ball bonding processes
I Qin, A Shah, C Huynh, M Meyer, M Mayer, Y Zhou
2009 11th Electronics Packaging Technology Conference, 573-578, 2009
132009
Reliability and availability analysis of three-state device redundant systems with human errors and common-cause failures
ASBS DHILLON
International Journal of Performability Engineering 3 (4), 411, 2007
102007
Advanced wire bonding technology for Ag wire
A Shah, T Rockey, H Xu, I Qin, W Jie, O Yauw, B Chylak
2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 1-8, 2015
92015
Effect of ultrasonic capillary dynamics on the mechanics of thermosonic ball bonding
Y Huang, A Shah, M Mayer, N Zhou, J Persic
IEEE transactions on ultrasonics, ferroelectrics, and frequency control 57 …, 2009
92009
Advances in Wire Bonding Technology for Different Bonding Wire Material
I Qin, A Shah, H Xu, B Chylak, N Wong
International Symposium on Microelectronics 2015 (1), 000406-000412, 2015
72015
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