| Additive manufacturing of metal structures at the micrometer scale L Hirt, A Reiser, R Spolenak, T Zambelli Advanced Materials 29 (17), 1604211, 2017 | 300 | 2017 |
| Stretchable heterogeneous composites with extreme mechanical gradients R Libanori, RM Erb, A Reiser, H Le Ferrand, MJ Süess, R Spolenak, ... Nature communications 3 (1), 1265, 2012 | 162 | 2012 |
| Templatefree 3D microprinting of metals using a forcecontrolled nanopipette for layerbylayer electrodeposition L Hirt, S Ihle, Z Pan, L DorwlingCarter, A Reiser, JM Wheeler, ... Advanced materials 28 (12), 2311-2315, 2016 | 150 | 2016 |
| Multi-metal electrohydrodynamic redox 3D printing at the submicron scale A Reiser, M Lindén, P Rohner, A Marchand, H Galinski, AS Sologubenko, ... Nature communications 10 (1), 1853, 2019 | 100 | 2019 |
| Metals by MicroScale Additive Manufacturing: Comparison of Microstructure and Mechanical Properties A Reiser, L Koch, KA Dunn, T Matsuura, F Iwata, O Fogel, Z Kotler, ... Advanced functional materials 30 (28), 1910491, 2020 | 37 | 2020 |
| Polymer nanocomposite patterning by dip-pen nanolithography AC Kandemir, D Erdem, H Ma, A Reiser, R Spolenak Nanotechnology 27 (13), 135303, 2016 | 16 | 2016 |
| Investigating the mechanism of collective bidirectional growth of carbon nanofiber carpets on metallic substrates A Röthlisberger, M Seita, A Reiser, E Shawat, R Spolenak, GD Nessim Carbon 63, 498-507, 2013 | 15 | 2013 |
| 3D electrohydrodynamic printing and characterisation of highly conductive gold nanowalls P Rohner, A Reiser, FT Rabouw, AS Sologubenko, DJ Norris, R Spolenak, ... Nanoscale 12 (39), 20158-20164, 2020 | 9 | 2020 |
| Ion-induced grain growth and texturing in refractory thin films—A low temperature process M Seita, A Reiser, R Spolenak Applied Physics Letters 101 (25), 251905, 2012 | 9 | 2012 |
| Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing M Menétrey, L Koch, A Sologubenko, S Gerstl, R Spolenak, A Reiser Small 18 (51), 2205302, 2022 | 1 | 2022 |
| Confined pulsed diffuse layer charging for nanoscale electrodeposition with an STM M Aarts, A Reiser, R Spolenak, E Alarcon-Llado Nanoscale Advances 4 (4), 1182-1190, 2022 | 1 | 2022 |
| Micron-scale additive manufacturing of binary and ternary alloys by electrohydrodynamic redox 3D printing N Porenta, M Nydegger, M Menétrey, S Hammadi, A Reiser, R Spolenak | | 2023 |
| Microparticle Impact Testing at High Precision, Higher Temperatures, and with Lithographically Patterned Projectiles A Reiser, CA Schuh Small Methods, 2201028, 2022 | | 2022 |
| Targeted Additive Micromodulation of Grain Size in Nanocrystalline Copper Nanostructures by Electrohydrodynamic Redox 3D Printing (Small 51/2022) M Menétrey, L Koch, A Sologubenko, S Gerstl, R Spolenak, A Reiser Small 18 (51), 2270276, 2022 | | 2022 |
| Electrohydrodynamic Redox 3D Printing: Confined Electroplating of Alloys for Additive Manufacturing at the Submicron Scale M Nydegger, N Porenta, M Menétrey, S Hammadi, A Reiser, R Spolenak Electrochemical Society Meeting Abstracts 241, 1119-1119, 2022 | | 2022 |
| Additive manufacturing of Zn with submicron resolution and its conversion into Zn/ZnO core–shell structures M Nydegger, A Pruška, H Galinski, R Zenobi, A Reiser, R Spolenak Nanoscale 14 (46), 17418-17427, 2022 | | 2022 |
| Nanoscale electrochemical 3D deposition of cobalt with nanosecond voltage pulses in an STM A Reiser, R Schuster, R Spolenak Nanoscale 14 (14), 5579-5588, 2022 | | 2022 |
| Additive manufacturing of multi-metals and multi-materials by electrohydrodynamic redox printing–towards 3D gradient materials with submicrometer resolution M Menétrey, A Reiser, L Koch, M Nydegger, R Spolenak | | 2020 |
| Additive manufacturing of metals at small length scales–microstructure, properties and novel multi-metal electrochemical concepts A Reiser ETH Zurich, 2019 | | 2019 |
| Multi-metal electrohydrodynamic redox 3d printing at the submicron scale: Microstructure–geometrical gradients–chemical gradients and the resulting mechanical properties R Spolenak, L Hauser, A Reiser, JW Wheeler | | 2019 |
