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Stephen A. Campbell
Stephen A. Campbell
Verified email at umn.edu
Title
Cited by
Cited by
Year
The science and engineering of microelectronic fabrication
SA Campbell
(No Title), 2001
16922001
The big picture on nanomedicine: the state of investigational and approved nanomedicine products
ML Etheridge, SA Campbell, AG Erdman, CL Haynes, SM Wolf, ...
Nanomedicine: nanotechnology, biology and medicine 9 (1), 1-14, 2013
11182013
MOSFET transistors fabricated with high permitivity TiO/sub 2/dielectrics
SA Campbell, DC Gilmer, XC Wang, MT Hsieh, HS Kim, WL Gladfelter, ...
IEEE Transactions on Electron Devices 44 (1), 104-109, 1997
5801997
Titanium dioxide (TiO 2)-based gate insulators
SA Campbell, HS Kim, DC Gilmer, B He, T Ma, WL Gladfelter
IBM journal of research and development 43 (3), 383-392, 1999
3921999
Fabrication engineering at the micro-and nanoscale
SA Campbell
(No Title), 2008
3252008
Chemical vapour deposition of the oxides of titanium, zirconium and hafnium for use as high‐k materials in microelectronic devices. A carbon‐free precursor for the …
RC Smith, T Ma, N Hoilien, LY Tsung, MJ Bevan, L Colombo, J Roberts, ...
Advanced Materials for Optics and Electronics 10 (3‐5), 105-114, 2000
2902000
Imaging and phase identification of Cu2ZnSnS4 thin films using confocal Raman spectroscopy
AJ Cheng, M Manno, A Khare, C Leighton, SA Campbell, ES Aydil
Journal of Vacuum Science & Technology A 29 (5), 2011
2892011
Doping efficiency, dopant location, and oxidation of Si nanocrystals
XD Pi, R Gresback, RW Liptak, SA Campbell, U Kortshagen
Applied Physics Letters 92 (12), 2008
277*2008
Internal photoemission of electrons and holes from (100)Si into
VV Afanas’ ev, A Stesmans, F Chen, X Shi, SA Campbell
Applied Physics Letters 81 (6), 1053-1055, 2002
2302002
An oxidation-resistant indium tin oxide catalyst support for proton exchange membrane fuel cells
H Chhina, S Campbell, O Kesler
Journal of Power Sources 161 (2), 893-900, 2006
2242006
Leakage current and electrical breakdown in metal‐organic chemical vapor deposited TiO2 dielectrics on silicon substrates
HS Kim, DC Gilmer, SA Campbell, DL Polla
Applied Physics Letters 69 (25), 3860-3862, 1996
2191996
The impact of genetic counselling about breast cancer risk on women’s risk perceptions and levels of distress
A Cull, EDC Anderson, S Campbell, J Mackay, E Smyth, M Steel
British journal of cancer 79 (3), 501-508, 1999
2111999
Does chemistry really matter in the chemical vapor deposition of titanium dioxide? Precursor and kinetic effects on the microstructure of polycrystalline films
CJ Taylor, DC Gilmer, DG Colombo, GD Wilk, SA Campbell, J Roberts, ...
Journal of the American Chemical Society 121 (22), 5220-5229, 1999
2021999
Air-stable full-visible-spectrum emission from silicon nanocrystals synthesized by an all-gas-phase plasma approach
XD Pi, RW Liptak, JD Nowak, NP Wells, CB Carter, SA Campbell, ...
Nanotechnology 19 (24), 245603, 2008
1972008
Anhydrous metal nitrates as volatile single source precursors for the CVD of metal oxide films
DG Colombo, DC Gilmer, VG Young Jr, SA Campbell, WL Gladfelter
Chemical Vapor Deposition 4 (6), 220-222, 1998
1781998
Structural and electrical characterization of TiO2 grown from titanium tetrakis‐isopropoxide (TTIP) and TTIP/H2O ambients
J Yan, DC Gilmer, SA Campbell, WL Gladfelter, PG Schmid
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer …, 1996
1711996
Approaching nanoxerography: The use of electrostatic forces to position nanoparticles with 100 nm scale resolution
HO Jacobs, SA Campbell, MG Steward
Advanced Materials 14 (21), 1553-1557, 2002
1512002
Plasma synthesis of single-crystal silicon nanoparticles for novel electronic device applications
A Bapat, C Anderson, CR Perrey, CB Carter, SA Campbell, U Kortshagen
Plasma physics and controlled fusion 46 (12B), B97, 2004
1472004
Room-temperature atmospheric oxidation of Si nanocrystals after HF etching
XD Pi, L Mangolini, SA Campbell, U Kortshagen
Physical Review B 75 (8), 085423, 2007
1442007
A study of mixtures of HfO2 and TiO2 as high-k gate dielectrics
F Chen, X Bin, C Hella, X Shi, WL Gladfelter, SA Campbell
Microelectronic Engineering 72 (1-4), 263-266, 2004
1282004
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