Anisotropic thermal conductivity and associated heat transport mechanism in roll-to-roll graphene reinforced copper matrix composites KM Yang, YC Ma, ZY Zhang, J Zhu, ZB Sun, JS Chen, HH Zhao, J Song, ... Acta Materialia 197, 342-354, 2020 | 55 | 2020 |
Synergistically enhanced interface stability by graphene assisted copper surface reconstruction KM Yang, Q Li, Q Zhang, GS Liu, JJ Wang, YF Yang, CX Guo, JM Ni, ... Acta Materialia 226, 117638, 2022 | 27 | 2022 |
Synthesis, microstructure and properties of magnetron sputtered lead zirconate titanate (PZT) thin film coatings Y Ma, J Song, X Wang, Y Liu, J Zhou Coatings 11 (8), 944, 2021 | 26 | 2021 |
High performance Nb/TiNi nanocomposites produced by packaged accumulative roll bonding D Jiang, J Song, H Yang, Y Liu, X Jiang, Y Ren, K Yu, L Cui Composites Part B: Engineering 202, 108403, 2020 | 23 | 2020 |
Recent progress on interfacial structure optimization and their influencing mechanism of carbon reinforced metal matrix composites T FAN, Y LIU, K YANG, J SONG, D ZHANG Acta Metall Sin 55 (1), 16-32, 2018 | 17 | 2018 |
Enhanced heat transport capability across boron nitride/copper interface through inelastic phonon scattering J Wang, Z Wang, K Yang, N Chen, J Ni, J Song, Q Li, F Sun, Y Liu, T Fan Advanced Functional Materials 32 (40), 2206545, 2022 | 16 | 2022 |
Orientation independent heat transport characteristics of diamond/copper interface with ion beam bombardment K Yang, Z Zhang, H Zhao, B Yang, B Zhong, N Chen, J Song, C Chen, ... Acta Materialia 220, 117283, 2021 | 13 | 2021 |
High strength and low coercivity of cobalt with three-dimensional nanoscale stacking faults Y Liu, J Song, G Liu, J Chen, C Wang, H Wang, J Wang, X Zhang Nano Letters 21 (15), 6480-6486, 2021 | 12 | 2021 |
Transferring elastic strain in Mo/Nb/TiNi multilayer nanocomposites by the principle of lattice strain matching D Jiang, J Song, H Yang, Y Liu, X Jiang, Y Ren, K Yu, L Cui Composites Part B: Engineering 215, 108784, 2021 | 12 | 2021 |
A crystal plasticity model for metal matrix composites considering thermal mismatch stress induced dislocations and twins YN Hou, KM Yang, J Song, H Wang, Y Liu, TX Fan Scientific Reports 11 (1), 16053, 2021 | 11 | 2021 |
Reorientation Mechanisms of Graphene Coated Copper {001} Surfaces J Song, S Yao, Q Li, J Ni, Z Yan, K Yang, G Liu, Y Liu, J Wang Metals 13 (5), 910, 2023 | 5 | 2023 |
Graphene layer number-dependent heat transport across nickel/graphene/nickel interfaces J Zhou, K Yang, B Yang, B Zhong, S Yao, Y Ma, J Song, T Fan, D Tang, ... ACS Applied Materials & Interfaces 14 (30), 35237-35245, 2022 | 5 | 2022 |
Ferroelectric and ferroelastic domain related formation and influential mechanisms of vapor deposited piezoelectric thin films C Chen, J Song, Q Zhang, M Gong, Y Liu, T Fan Coatings 11 (12), 1437, 2021 | 5 | 2021 |
In-situ TEM characterization of basal dislocations between nano-spaced long-period stacking ordered phases in MgYZn alloy Q Li, J Song, Y Chen, Q Zhang, Q Zhu, Y Liu, J Wang, X Zeng Scripta Materialia 235, 115601, 2023 | 4 | 2023 |
Formation of misfit dislocation arrays and helium nanochannels near copper surface assisted by high-temperature graphene deposition KM Yang, GS Liu, HY Ma, J Song, Q Li, NQ Chen, YQ Wang, D Chen, ... Acta Materialia 237, 118134, 2022 | 4 | 2022 |
Characterization of the terrace-defect interfaces using in situ straining techniques J Song, J Wang, Y Liu Journal of Materials Research 36, 2674-2686, 2021 | 2 | 2021 |
Thickness-dependent strain rate sensitivity of nanolayers via the nanoindentation technique J Song, Y Liu, Z Fan, X Zhang Crystals 8 (3), 128, 2018 | 2 | 2018 |
Achieving atomically flat copper surface: Formation of mono-atomic steps and associated strain energy mechanisms J Song, Q Zhang, S Yao, K Yang, H Ma, J Ni, B Zhong, Y Liu, J Wang, ... Acta Materialia 263, 119414, 2024 | 1 | 2024 |
Significant strengthening of copper-based composites using boron nitride nanotubes N Chen, Q Li, Y Ma, K Yang, J Song, Y Liu, T Fan International Journal of Minerals, Metallurgy and Materials 30 (9), 1764-1778, 2023 | 1 | 2023 |
Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States N Chen, K Yang, Z Wang, B Zhong, J Wang, J Song, Q Li, J Ni, F Sun, ... ACS Applied Materials & Interfaces 15 (28), 34132-34144, 2023 | 1 | 2023 |