| Low temperature sintering of Ag nanoparticles for flexible electronics packaging A Hu, JY Guo, H Alarifi, G Patane, Y Zhou, G Compagnini, CX Xu Applied Physics Letters 97 (15), 153117, 2010 | 312 | 2010 |
| Modelling of transient liquid phase bonding Y Zhou, WF Gale, TH North International Materials Reviews 40 (5), 181-196, 1995 | 294 | 1995 |
| Growth behavior of Cu/Al intermetallic compounds and cracks in copper ball bonds during isothermal aging CJ Hang, CQ Wang, M Mayer, YH Tian, Y Zhou, HH Wang Microelectronics reliability 48 (3), 416-424, 2008 | 265 | 2008 |
| Effects of heat input and martensite on HAZ softening in laser welding of dual phase steels M Xia, E Biro, Z Tian, YN Zhou ISIJ international 48 (6), 809-814, 2008 | 232 | 2008 |
| Microjoining and nanojoining Y Zhou Woodhead Publishing and Maney Publishing, 2008 | 210 | 2008 |
| Joining of Silver Nanomaterials at Low Temperatures: Processes, Properties, and Applications P Peng, A Hu, AP Gerlich, G Zou, L Liu, YN Zhou ACS applied materials & interfaces 7 (23), 12597-12618, 2015 | 206 | 2015 |
| Microstructure and mechanical properties of laser welded DP600 steel joints N Farabi, DL Chen, J Li, Y Zhou, SJ Dong Materials Science and Engineering: A 527 (4-5), 1215-1222, 2010 | 197 | 2010 |
| Preparation of PVP coated Cu NPs and the application for low-temperature bonding Y Jianfeng, Z Guisheng, H Anming, YN Zhou Journal of Materials Chemistry 21 (40), 15981-15986, 2011 | 194 | 2011 |
| Self-assembly of large-scale and ultrathin silver nanoplate films with tunable plasmon resonance properties XY Zhang, A Hu, T Zhang, W Lei, XJ Xue, Y Zhou, WW Duley ACS nano 5 (11), 9082-9092, 2011 | 185 | 2011 |
| Pressureless bonding process using Ag nanoparticle paste for flexible electronics packaging J Yan, G Zou, A Wu, J Ren, J Yan, A Hu, Y Zhou Scripta Materialia 66 (8), 582-585, 2012 | 181 | 2012 |
| Microstructure and mechanical properties of laser welded dissimilar DP600/DP980 dual-phase steel joints N Farabi, DL Chen, Y Zhou Journal of Alloys and Compounds 509 (3), 982-989, 2011 | 180 | 2011 |
| Tempering of martensite in dual-phase steels and its effects on softening behavior VH Baltazar Hernandez, SS Nayak, Y Zhou Metallurgical and Materials Transactions A 42 (10), 3115-3129, 2011 | 177 | 2011 |
| Resistance and friction stir spot welding of DP600: a comparative study MI Khan, ML Kuntz, P Su, A Gerlich, T North, Y Zhou Science and Technology of Welding & Joining 12 (2), 175-182, 2007 | 170 | 2007 |
| Effects of weld microstructure on static and impact performance of resistance spot welded joints in advanced high strength steels MI Khan, ML Kuntz, Y Zhou Science and Technology of Welding & Joining 13 (3), 294-304, 2008 | 166 | 2008 |
| Hydrothermal growth of free standing TiO2 nanowire membranes for photocatalytic degradation of pharmaceuticals A Hu, X Zhang, KD Oakes, P Peng, YN Zhou, MR Servos Journal of Hazardous Materials 189 (1-2), 278-285, 2011 | 163 | 2011 |
| Generation of oxygen vacancies in visible light activated one-dimensional iodine TiO 2 photocatalysts W Li, R Liang, A Hu, Z Huang, YN Zhou RSC Advances 4 (70), 36959-36966, 2014 | 155 | 2014 |
| Tensile and fatigue properties of fiber laser welded high strength low alloy and DP980 dual-phase steel joints W Xu, D Westerbaan, SS Nayak, DL Chen, F Goodwin, Y Zhou Materials & Design 43, 373-383, 2013 | 136 | 2013 |
| Surface modification of resistance welding electrode by electro-spark deposited composite coatings: Part I. Coating characterization Z Chen, Y Zhou Surface and Coatings Technology 201 (3-4), 1503-1510, 2006 | 136 | 2006 |
| Silver nanoparticle paste for low-temperature bonding of copper H Alarifi, A Hu, M Yavuz, YN Zhou Journal of Electronic Materials 40 (6), 1394-1402, 2011 | 135 | 2011 |
| Influence of microstructure and weld size on the mechanical behaviour of dissimilar AHSS resistance spot welds BVH Hernandez, ML Kuntz, MI Khan, Y Zhou Science and Technology of Welding & Joining 13 (8), 769-776, 2008 | 134 | 2008 |
Anming HuAssociate Professor, University of Tennessee Knoxville在 utk.edu 的电子邮件经过验证
